Biometric sensor

ABSTRACT

A biometric sensor includes a body surface sensor and an e-field signal transmitter. The body surface sensor create a drive-sense signal at a first frequency based on one or more sensing parameters. When operably coupled to a body via one or more electrodes, the body surface sensor provides the drive-sense signal to the body and detects an effect on the drive-sense signal based on electrical characteristics of the body. The body surface sensor generate a data signal based on the detected effect, wherein the data signal represents the body’s electrical characteristics. The e-field signal transmitter generates an outbound signal reference at a second frequency based on the data signal and one or more transmit parameters. The e-field transmitter drives the outbound reference signal to the body, wherein the outbound reference signal is transmitted within at least a portion of the body as an outbound e-field signal at the second frequency.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present U.S. Utility Pat. Application claims priority pursuant to 35U.S.C. § 120 as a continuation of co-pending U.S. Utility Pat.Application No. 17/823,729 entitled, “PERSONAL MONITORING SYSTEM USINGE-FIELD COMMUNICATIONS VIA A BODY”, filed Aug. 31, 2022, which claimspriority pursuant to 35 USC § 120 as a continuation-in-part ofco-pending U.S. Utility Pat. Application No. 17/649,506, entitled“VARIABLE SAMPLING RATE WITHIN A FOOT FORCE DETECTION SYSTEM”, filedJan. 31, 2022, which claims priority as a continuation-in-part of U.S.Utility Pat. Application No. 15/679,831, entitled “WIRELESS IN-SHOEPHYSICAL ACTIVITY MONITORING APPARATUS,” filed Aug. 17, 2017, now U.S.Pat. No. 11,246,507, issued on Feb. 15, 2022, which claims prioritypursuant to 35 U.S.C. § 119(e) to U.S. Provisional Application No.62/376,555, entitled “IN-SHOE GROUND REACTIVE FORCE MEASURING SYSTEM,”filed Aug. 18, 2016, all of which are hereby incorporated herein byreference in their entirety and made part of the present U.S. UtilityPat. Application for all purposes.

U.S. Utility Pat. Application No. 17/823,729 also claims prioritypursuant to 35 U.S.C. § 120 as a continuation-in-part of co-pending U.S.Utility Pat. Application No. 17/575,594, entitled “INSOLE XYZ FORCEDETECTION SYSTEM,” filed Jan. 13, 2022, which claims priority pursuantto 35 U.S.C. § 119(e) to U.S. Provisional Application No. 63/202,251,entitled “INSOLE XYZ FORCE DETECTION SYSTEM,” filed Jun. 03, 2021, bothof which are hereby incorporated herein by reference in their entiretyand made part of the present U.S. Utility Pat. Application for allpurposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

Not Applicable.

TECHNICAL FIELD OF THE INVENTION

This disclosure relates generally to a data communication system andanalysis and more particularly to data regarding a body.

DESCRIPTION OF RELATED ART

Technology is being used more and more to monitor a person’s physicalactivities, rest patterns, diet, and vital signs. Some of thistechnology is wearable. For example, there are wrist wearable devices tomonitor the number of steps a person takes in a day, the approximatedistance traveled, heart rate, and/or sleep patterns. As anotherexample, there are chest straps that communicate wirelessly with amodule for monitoring heart rate.

As yet another example, there are shoe insert systems to monitor forcesof the foot during walking. One such system includes a flexible circuitboard insert that includes a resistive sensor grid that is hard wired toa module that straps to the ankle. The two ankle modules are then hardwired to another module that straps to the waist. The waist modulecollects the data and communicates it to a computer via a wired orwireless connection.

Another technology for monitoring foot force is to use a pressuresensitive mat on which a person stands to perform a physical activity(e.g., golf). The mat detects variations in foot forces during theexecution of the physical activity, which is then analyzed to evaluatethe performance of the physical activity.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a personalmonitoring system;

FIG. 2 is a schematic block diagram of another embodiment of a personalmonitoring system;

FIG. 3 is a schematic block diagram of another embodiment of a personalmonitoring system;

FIG. 4 is a schematic block diagram of another embodiment of a personalmonitoring system;

FIG. 5 is a schematic block diagram of another embodiment of a personalmonitoring system;

FIG. 6 is a schematic block diagram of another embodiment of a personalmonitoring system;

FIG. 7 is a schematic block diagram of another embodiment of a personalmonitoring system;

FIG. 8 is a schematic block diagram of another embodiment of a personalmonitoring system;

FIG. 9 is a diagram of an example of frequency band allocation for usewithin a personal monitoring system;

FIG. 10 is a schematic block diagram of an example of e-field signalcommunication within a personal monitoring system;

FIG. 11 is a schematic block diagram of another example of e-fieldsignal communication within a personal monitoring system;

FIG. 12 is a schematic block diagram of an example of e-field signalcommunication and RF communication within a personal monitoring system;

FIG. 13 is a schematic block diagram of another example of e-fieldsignal communication and RF communication within a personal monitoringsystem;

FIG. 14 is a schematic block diagram of an example of RF communicationwithin a personal monitoring system;

FIG. 15 is a schematic block diagram of an example of on body surfacesensing within a personal monitoring system;

FIG. 16 is a schematic block diagram of an example of on body surfacesensing via a sensing element within a personal monitoring system;

FIG. 17 is a schematic block diagram of an example of inner body sensingwithin a personal monitoring system;

FIG. 18 is a schematic block diagram of an embodiment of an e-fieldsignal receiver;

FIG. 19 is a schematic block diagram of an embodiment of a couplingcircuit;

FIG. 20 is a schematic block diagram of another embodiment of a couplingcircuit;

FIG. 21 is a schematic block diagram of an embodiment of an e-fieldsignal transmitter;

FIG. 22 is a schematic block diagram of an embodiment of body surfacesensor;

FIG. 23 is a schematic block diagram of an embodiment of body surfacesensor that includes a sensing element;

FIG. 24 is a schematic block diagram of an embodiment of an inner bodysurface sensor;

FIG. 25 is a schematic block diagram of an example of a relationship ofID, sensing, & e-field communication frequencies within a personalmonitoring system;

FIGS. 26A - 26C are schematic block diagrams of embodiments of aprogrammable sense signal generator;

FIG. 27A is a schematic block diagram of an embodiment of a programmableoutbound signal generator;

FIG. 27B is a schematic block diagram of an embodiment of a programmabletx/rx signal generator;

FIGS. 28A - 28D are diagrams of example signals within the personalmonitoring system;

FIG. 29 is a schematic block diagram of an embodiment of a power sourcemodule;

FIG. 30 is a schematic block diagram of another embodiment of a powersource module;

FIG. 31 is a schematic block diagram of another embodiment of a powersource module;

FIG. 32 is a schematic block diagram of an embodiment of a communicationdevice;

FIG. 33 is a schematic block diagram of another embodiment of acommunication device;

FIG. 34 is a schematic block diagram of another embodiment of acommunication device;

FIG. 35 is a schematic block diagram of another embodiment of acommunication device;

FIG. 36 is a schematic block diagram of another embodiment of acommunication device;

FIG. 37 is a schematic block diagram of another embodiment of acommunication device;

FIG. 38 is a schematic block diagram of another embodiment of acommunication device;

FIG. 39 is a schematic block diagram of another embodiment of acommunication device;

FIG. 40 is a schematic block diagram of an embodiment of a biometricsensor;

FIG. 41 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 42 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 43 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 44 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 45 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 46 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 47 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 48 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 49 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 50 is a schematic block diagram of another embodiment of abiometric sensor;

FIG. 51 is a schematic block diagram of an embodiment of a foot forcesensing cell unit;

FIG. 52 is a schematic block diagram of another embodiment of a footforce sensing cell unit;

FIG. 53 is a schematic block diagram of another embodiment of a footforce sensing cell unit;

FIGS. 54A - 54D are schematic block diagrams of an example ofconstruction of a foot force sensing cell unit;

FIG. 55 is a schematic block diagram of an example of a sole piece thatincludes receptacles for foot force sensing cell units;

FIGS. 56A - 56E are schematic block diagrams of an example of placing afoot force sensing cell unit in a receptacle of a sole piece of FIG. 55;

FIG. 57 is a schematic block diagram of another example of a sole piecethat includes receptacles for foot force sensing cell units;

FIGS. 58A - 58E are schematic block diagrams of an example of placing afoot force sensing cell unit in a receptacle of a sole piece of FIG. 57;

FIG. 59 is a schematic block diagram of another example of a bodyposition/motion marker; and

FIG. 60 is a schematic block diagram of another example of an integratedbiometric sensor and body position/motion marker.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a personalmonitoring system 10 that includes a communication device 12, one ormore passive biometric sensors 14, a passive right foot force sensingunit 18-R, a passive left foot force sensing unit 18-L, a personalcoordinate unit 20 for body position and motion, and a plurality ofpassive body position/motion markers 22. As used herein, passive meansfully passive or battery assisted passive.

Fully passive means a device, unit, and/or circuit that harvests powerfrom radio frequency (RF) signals, motion, heat, compression, light,sonic vibrations, and/or ultrasonic vibrations and does not include abattery. Battery assisted passive means a device, unit, and/or circuitthat harvests power from radio frequency (RF) signals, motion, heat,compression, light, sonic, and/or ultrasonic vibrations and does includea battery. For battery assisted passive devices, units, and/or circuitsat least ten percent of the power that they consume is produced by oneor more power harvesting circuits and the remaining power is provided bythe battery.

In this embodiment of the personal monitoring system 10, it monitors oneor more biomechanical expressions and one or more physiologicalresponses. Biomechanical expressions include, but are not limited to,body movement, ground-body connection, and forces that impact bodymovements. Physiological responses include, but are not limited to,heart rate, respiration rate, temperature, perspiration, hydration,weight, and neurological systems (e.g., sensing electrochemical bodilyfunctions such as muscle activity, brain activity, etc.).

The biometric sensor 14 senses one or more physiological responses, thefoot force units 18 senses the forces of the ground-body connection, andthe personal coordinate unit 20 senses body movement via the passivebody position/motion markers 22. The biometric sensor 14 and the footforce sensing units 18 provide their sensed data to the communicationdevice 12 via e-fielding signaling, which occurs through the body. Thepersonal coordinate unit 20 provides body position data to thecommunication device 12 in a variety of ways. For example, the personalcoordinate unit 20 provides body position data to the communicationdevice 12 via e-field signaling. As another example, the personalcoordinate unit 20 is embedded in the communication device 12 andprovides the body position data via a bus or other internalcommunication connection. As a further example, the personal coordinateunit 20 provides the body position data to communication device 12 viaRF communications (e.g., Bluetooth, 60 GHz personal area network, RFIDlike communication (e.g., backscatter)).

The physical embodiment of the communication device 12 may beimplemented in a variety of ways. For example, the communication device12 is physically embodied in a ring. As another example, thecommunication device 12 is physically embodied in a wrist band. As yetanother example, the communication device 12 is physically embodied in adongle that clips to an item of clothing. As a further example, thecommunication device 12 is physically embodied in a necklace. As a stillfurther example, the communication device 12 is physically embodied in awatch (e.g., smart or regular). Basically, the physical embodiment ofthe communication device 12 may be any wearable item.

The communication device 12 provides the data it gathers from thebiometric sensor 14, the foot force sensing units 18, and/or thepersonal coordinate unit 20 to a computing device 24 via a wirelesscommunication. The wireless communication may be an RF communication ora near field communication (NFC). For an RF communication, thecommunication device 12 and the computing device include an RFtransceiver, such as a Bluetooth RF transceiver, a wireless local areanetwork (WLAN or wi-fi) RF transceiver, and/or a personal area networkRF transceiver.

The computing device 24 is any device that is capable of executingoperational instructions of an algorithm to produce a data result. Suchcomputing devices include, but are not limited to, cellular telephones,tablets, personal computers, laptop computers, cloud-based computers,servers, cloud-based servers, databases, and cloud-based databases.

The computing device 24 and/or the communication unit 12 process thecollected (or gathered) data to track physical activity of a person, totrack physical movement of a person, to track forces on the person’sbody, and/or to track physiological responses. The computing device 24further interprets the collected data to make recommendations regardingrest, injury recovery, improving physical movement, improving athleticconditioning, improving athletic performance, fatigue levels, fatiguerecovery, recommended physical activity intensity, weight loss, waterweight loss during an event, calorie expenditures, etc.

For the computing device 24 to perform one or more of its desiredfunctions, some physiological responses (e.g., heart rate, temperature,and/or respiration) are sensed 24/7 (twenty-four hours a day, 7 days perweek) or as close to that has possible (e.g., 12 or more hours per day).Other physiological responses (e.g., perspiration, hydration, weight,neurological systems) can be monitoring during activity of a personand/or periodically throughout a day. Of course, these laterphysiological responses could also be monitored up to a 24/7 if desiredby the user of the body monitoring system.

In addition, the biomechanical expressions (e.g., movement of a body,the forces that put the body in motion, and/or other forces that actupon the body (e.g., hitting a golf ball)) are typically monitored whilea person is in motion (e.g., running, walking, standing, playing asport, etc.) but could also be monitored while the person is at rest.For example, body position and motion tracking could be used while aperson is sleeping to record how the person tosses and turns during thenight.

The personal monitoring system 10 provides a variety of benefitsincluding, but not limited to, data accuracy, low power consumption,reliability, in-field use, ease of use, no wires to the sensors,durability, and/or a complete data set of personal data that provides anear endless opportunity for analysis a person’s movement, physicalperformance, and/or health and for assisting the person in improving theperson’s movement, physical performance, and/or health.

As described below and as may be described in one or more of the parentpatent applications, the biometric sensor 14, the foot force sensingunits 18, and the personal coordinate unit 20 use a core drive-sensecircuit that provides approximately 140 dB of signal to noise ratio(SNR). With such a high SNR, real-time and high resolution biomechanicalexpression data and/or physiological response data is collected andeliminates predictive algorithms that have to calculate a biomechanicalexpression or a physiological response to non-real-time data and/or lowresolution data. As such, collected data and the various uses of it aremuch more accurate than is obtainable with predictive algorithms.

As a specific example, body movement over a distance with the personalmonitoring system 10 has an error margin of about +/-0. 1%. In contrast,predictive algorithms that use step count and/or arm movement have anerror margin of about +/- 10% or more. As another specific example, aheart rate biometric sensor senses the electrical signals of the heart(e.g., functions like an EKG and/or ECG) to determine heart rate with anerror margin of about +/-0.1%. In contrast, an optical heart ratemonitor, which uses photoplethysmography (PPG), measures the amount oflight that is scatter by blood flow. In wearable devices, opticaldetection of heart rate has an error margin of about +/-5% or more.

With the use of passive technology in the biometric sensors, the footforce sensors, and the markers 22 for body position and motion, theyrarely, if ever need to be charged. Thus, the user rarely, if every hasto worry about charging the sensors. Further, the use of e-fieldsignaling and/or RF signaling to convey sensed data, the biometricsensors, the foot force sensors, and the markers 22 have no connectingwires. This increases the durability and ease of use of the personalmonitoring system 10.

FIG. 2 is a schematic block diagram of another embodiment of a personalmonitoring system 10. In this embodiment, the personal monitoring system10 includes one or more biometric sensors 14 and the communicationdevice 12. In this embodiment, the personal monitoring system 10measures one or more physiological responses (e.g., heart rate,respiration, perspiration, hydration, temperature, etc.) and sends thecollected data to the computing 24.

FIG. 3 is a schematic block diagram of another embodiment of a personalmonitoring system 10 that includes the left and right foot force sensingunits 18-R & 18-L and the communication unit 12. In this embodiment, thepersonal monitoring system 10 measures the forces of the ground bodyconnection, which include athletic force, ground reaction force, andforces traversing through the shoes.

Athletic force includes the weight of a person and force exerted as aresult of muscle contraction (e.g., muscles contraction for a jump). Theground reaction force is the ground pushing back on the body in an equaland opposite direction of the force the ground receives. The shoe directthe force between the body and the ground and can do so in aconstructive manner, a neutral manner, or a nonconstructive manner.

FIG. 4 is a schematic block diagram of another embodiment of a personalmonitoring system 10 that includes the personal coordinate unit 20, thepassive body position/motion markers 22, and the communication device12. In this embodiment, the personal coordinate unit 20 creates acoordinate system encompassing the user of the personal monitoringsystem 10. In an example, the coordinate system is a Cartesiancoordinate system (e.g., x, y, and z axis).

The original of the coordinate system is tied to a point on the body andis fixed in x, y, and z directions with respect to the ground. Forexample, the z-direction is perpendicular to the ground; the x-directionis forward or backward for the person’ and the y-direction is left orright for the person.

The personal coordinate unit 20 transmits an RF signals to a passivebody position/movement marker 22. The RF signal includes anidentification code (ID) for the personal monitoring system 10. Thepassive body position/movement marker 22 harvests power from the RFsignal, measures the signal strength of the received RF signal, andtransmits a response signal to the personal coordinate unit 20. Theresponse signal includes the signal strength measurement and the ID.

The personal coordinate unit 20 determines the distance between themarker 22 and at least three transmitter positions based on an RF signalstrength attenuation versus distance curve for the frequency of the RFsignal. The personal coordinate unit 20 determines the position of themarker 22 based on the three distances and then maps the position of themarker 22 to the coordinate system.

FIG. 5 is a schematic block diagram of another embodiment of a personalmonitoring system 10 that is similar to the embodiment of FIG. 1 . Inthis embodiment, the communication device 12 is embedded in a personalcomputing device 26. The personal computing device 26 is a device thatis readily wearable on the body such as a cell phone or smart watch.Alternative, the personal computing device 26 is a custom computingdevice for the personal monitoring system 10 that executes the desireddata analysis algorithms and has wireless connectivity to anothercomputing device and/or to the cloud.

FIG. 6 is a schematic block diagram of another embodiment of a personalmonitoring system 10 is similar to the embodiment of FIG. 1 with theinclusion of one or more integrated biometric sensor & bodyposition/motion marker 28. As the name implies, the integrated biometricsensor & body position/motion marker 28 provides a biometric sensingfunction and a body position/motion marker function.

FIG. 7 is a schematic block diagram of another embodiment of a personalmonitoring system 10 is similar to the embodiment of FIG. 6 with thecommunication device 12 being embedded in the personal computing device26.

FIG. 8 is a schematic block diagram of another embodiment of twopersonal monitoring systems 10-1 & 10-2 in close proximity. Each personmonitoring system includes a communication device 12, one or morepassive biometric sensors 14, a passive right foot force sensing unit18-R, a passive left foot force sensing unit 18-L, a personal coordinateunit 20 for body position and motion, a plurality of passive bodyposition/motion markers 22, and/or one or more integrated biometricsensor & body position/motion marker 28.

Each system functions independently and communicates with one or morecomputing devices 24. In one instance, both systems 10 communicate withthe same computing device 24. In another instance, each system 10communicates with its own computing device 24. For example, when thesystems 10 are being used by players on a team, the systems 10 wouldcommunicate with the same computing device. As another example, when thesystems are being used by runners in a race, the systems 10 wouldcommunicated with different computing devices 24.

To distinguish between the two systems 10, each system 10 is assigned asystem ID. In this example, system 10-1 is assigned system ID 001 andsystem 10-2 is assigned system ID 002. The components of the systems 10use the respective system IDs to confirm communications are for therespective system 10.

FIG. 9 is a diagram of an example of frequency band allocations for usewithin a personal monitoring system 10. In the system 10 of FIG. 1 ,there are four frequency bands. The first frequency band is for acousticand/or ultrasound biometric sensing. The second frequency band is fore-field communication related sensing and communications. The thirdfrequency band is for RF power harvesting. The fourth frequency band isfor body position sensing.

The acoustic & ultrasound frequency band is used for transducer basedsensors that are tuned for such frequencies. For example, a transducergenerates an electrical signal corresponding to the acoustic vibrationof a heartbeat. As another example, a transducer generates an electricalsignal corresponding to the acoustic vibration of respiration.

The RF frequency band for power harvesting is in the range of 900 MHz to6 GHz. These are frequencies used by cell phones, wi-fi enabled devices,RFID readers, and a plurality of other devices. In most geographiclocations in a country, these frequencies are prevalent and transmittedwith sufficient power to enable power harvesting thereof.

The RF frequency band for body position is above 20 GHz (e.g., 57 - 64GHz). At such frequencies, the attenuation in air is significant overshort distances (e.g., 10 or more dB per meter). As such, by determiningthe power loss of a transmitted signal, the distance between thetransmitter and receiver can be determined. Further, since the signalonly needs to readable for a short distance (e.g., about 3 meters), itcan be transmitted at very low power levels (e.g., micro-watts or more).

The e-field frequency band, which is in the range of tens of KHz tohundreds of MHz (avoiding the AM radio frequency band (535 KHz - 1705KHz,) the FM radio frequency band (88 MHz to 108 MHz), and otherlicensed frequency bands), includes three sub-band sections: an IDfrequency sub-band, a sensing frequency sub-band, and a TX/RX(transmit/receive) frequency sub-band. The ID frequency sub-band isallocated for system IDs; the sensing frequency sub-band is allocatedfor biometric sensing and/or force sensing; and the TX/RX frequencysub-band is allocated for e-field signaling communication between thecommunication device 12 and the components of the personal monitoringsystem 10.

In an embodiment, an allocated sensing frequency and an allocated TX/RXfrequency are derived from a system ID frequency. For example, thesensing frequency equals the system ID frequency plus a sensingfrequency offset. As another example, the TX/RX equals the system IDfrequency plus a TX/RX frequency offset. As yet another example, theTX/RX equals the allocated sensing frequency plus a TX/RX frequencyoffset.

The following table is a simplified example of e-field frequencyallocation.

part System ID sense_offset f_sense tx/rx_offset f_tx/rx system 1 100KHz sensor 1 100 KHz 200 KHz 200 KHz 300 KHz sensor 2 110 KHz 210 KHz210 KHz 310 KHZ System 2 105 KHz sensor 1 100 KHz 205 KHz 200 KHz 305KHz sensor 2 110 KHz 215 KHz 200 KHz 315 KHZ

As another example, in a personal monitoring system 10 that includesfive biometric sensors, the personal coordinate system, and the footforce sensing units, the system 10 would have one system ID frequency(e.g., 100 KHz), five f_sense frequencies and five f_tx/rx frequenciesfor the five biometric sensors, one f_tx/rx frequency for the personalcoordinate system, thirty f_sense frequencies for fifteen force sensecells in each shoe, and two f_tx/rx frequencies; one for each shoe. Thetx/rx frequencies are used for e-field signaling and the f_sensefrequencies are used for sensing.

FIG. 10 is a schematic block diagram of an example of e-field signalcommunication within a personal monitoring system 10. In this example, abiometric sensor 14 is connected to a body 30 via an electrode 32. Thebiometric sensor 14 is electrically coupled to the electrode 32 and maybe adhered to the body 30 in a desired position. For example, thebiometric sensor 14 is an adhesive patch that sticks to the skin of thebody.

The biometric sensor 14 uses an f_sense frequency to sense aphysiological response (e.g., heart rate) and produces raw sensed data(e.g., the electrical effect on a drive signal as discussed below). Thebiometric sensor 14 sends the raw sensed data to the communicationdevice 12 via the body using e-field signaling 34. This will bedescribed in greater detail in subsequent figures.

This example further includes a foot force sensing unit 18 coupled to anelectrode 32, which is in contact with the body. Depending on the numberof foot force sensing cells in a shoe and on the number of capacitors ina sensing cell, a foot force sensing unit captures a plurality of rawfoot force data (e.g., the electrical effect on a drive signal of eachof the capacitors in a shoe). The foot force sensing unit sends to rawfoot force data to the communication device 12 via e-field signaling 34.

The computing device 12 is coupled to an electrode 32, which is proximal(i.e., touching or nearly touching) to the body 30. Depending on theconfiguration of the computing device 12, it can handle the raw data itreceives in a variety of ways. In a configuration, the communicationdevice 12 forwards the raw data it receives to the computing device 24in accordance with an RF communication protocol (e.g., Bluetooth, WLAN,cellular data conveyance, etc.).

In another configuration, the communication device 12 converts the rawdata into sensed data. For example, the communication device 12 covertsthe raw data of a heart rate biometric sensor into a beats-per-minutevalue. In this configuration or another, the communication device 12converts the raw data of a capacitance foot force sensor into acapacitor value. In an extension of this configuration or as anotherconfiguration, the communication device 12 converts the raw data of acapacitance foot force sensor into a capacitor value and then into aforce value. After calculating the values, the communication device 12sends the calculated values to the computing device 24.

FIG. 11 is a schematic block diagram of another example of e-fieldsignal communication within a personal monitoring system 10. This figureis similar to FIG. 10 with a difference being that the communicationdevice 12 is part of the personal computing device 26. In this example,the communication device 12 receives the raw data from the sensors 14and 18 and via an internal connection provides the raw data, or valuescalculated therefrom, to a processing module of the personal computingdevice 26 for further processing.

FIG. 12 is a schematic block diagram of an example of e-field signalcommunication and RF communication within a personal monitoring system10. In this example, the personal coordinate unit 20 is coupled to anelectrode 32 and a passive body position marker 22 is coupled to anelectrode 32. The personal coordinate unit 20 communicates with thecommunication device 12 via e-field communications 34 and communicateswith a passive body position marker 22 via RF communications. Thecommunication device 12 communicates, via e-fielding signaling, an IDsignal 36 to the passive body position marker 22.

To determine a distance between the personal coordinate unit 20 and thepassive body position marker 22, the personal coordinate unit 20transmits an RF signal to marker 22. The RF signal is transmitted at aknown power level. Upon receiving the RF signal, the marker 22determines the received signal strength, which can be done via aconventional RSSI (received signal strength indication) circuit. Themarker 22 then sends a response RF signal to the personal coordinateunit 20, the response signal includes the received signal strength andthe system ID.

The personal coordinate unit 20 verifies the system ID to ensure thatthe response RF signal is from a marker associated with the personalmonitoring system 10. When the marker is associated with the system 10,the personal coordinate unit 20 recovers the received signal strengthmeasurement and compares it to the known transmit power level todetermine an attenuation factor. Based on the frequency of the RF signal(e.g., 5 GHz, 28 GHz, 60 GHz, etc.), the personal coordinate unit 20determines a distance based on the attenuation factor and an attenuationto distance curve for the corresponding frequency.

Using at least two differently positioned transmitters associated withthe personal coordinate unit 20, the unit 20 repeats the process to getat three distances to the marker 22. From the at three distances, thepersonal coordinate unit 20, the communication device 12, and/or thecomputing device 24 or 26 determines the position of the marker 22 onthe personal coordinate system based on the at least three distances.

FIG. 13 is a schematic block diagram of another example of e-fieldsignal communication and RF communication within a personal monitoringsystem. This example is similar to the example of FIG. 12 with theexception that the personal coordinate unit 20 is part of thecommunication device 12. In this example, the passive body positionmarker 22 can respond with the RSSI and the system ID via a response RFsignal and/or via a response e-field signal 35.

FIG. 14 is a schematic block diagram of an example of RF communicationwithin a personal monitoring system. This example is similar to theexample of FIG. 13 with the exception that communication is only donevia RF signals. In this example, the passive body position marker 22respond with the RSSI and the system ID via a response RF signal.

FIG. 15 is a schematic block diagram of an example of on body surfacesensing within a personal monitoring system 10. As a simplifiedelectrical diagram of a body 30, the body includes an AC voltage source45 and an impedance network 40. The AC voltage source 45 represents thevarious electrochemical reactions of the body that produce a voltage 42and a current 44 that stimulate muscle contraction, stimulate thenervous system, stimulate heart beats, stimulate brain activity, and soon.

The body impedance network 40 comprises the blood, bones, muscle, cells,etc. that make up the body and conduct current 44 produces by thevoltage 42 of the electrochemical reactions of the body. In thissimplified representation, the impendence network 40 of the body is adistributed RC (resistor-capacitor) network and, in the e-fieldfrequency band, is primarily a capacitor network.

The drive sense circuit of a body surface sensor “a” includes a voltagereference generator 50, an operational amplifier 46, a dependent currentsource 48, and may further include a feedback circuit (not shown)coupled between the output of the op-am 46 and the input of thedependent current source 48. The voltage reference generator 50generates an AC reference voltage (e.g., a sinusoid at a frequencywithin the sensing sub-band of the e-field frequency band).

The op-amp 46 functions to match the voltage on each of its inputs. Assuch, the voltage on both inputs is equal to the AC reference voltage ofgenerator 50, which means that the voltage of the drive signal 52 equalsthe AC reference voltage. The drive sense circuit provides the drivesignal 52 to a first electrode 32 that is positioned proximal to asurface of the body 30. For example, the first electrode 32 is touchingor almost touching the skin of a person.

A second electrode 32 is also positioned proximal to the surface of thebody 30 and a distance from the first electrode 32. Note that anelectrode is comprised in an electrically conductive material (e.g., acopper strip) that is of a certain size (e.g., a few microns per side toone or more centimeters per side). The second electrode provides areturn path for the drive sense circuit.

The dependent current source 48 generates a current based on the outputof the op-amp 46 to keep the voltage of the drive signal 52 matching thereference voltage of generator 50. The current traverses through theelectrodes 32 and a corresponding portion of the impedance network 40 ofthe body 30. In an instance, the corresponding portion of the impedancenetwork 40 is essentially a capacitor, which has a particular impedanceat the frequency of drive signal 52.

The output of the op-amp 46 represents the adjustments to the current ofthe drive signal 52 caused by the effect 54 of the body capacitance tokeep the voltage of the drive signal 52 matching the voltage of thereference voltage. By knowing the current (I) and the voltage (V), andthe particular impedance (Z) of the body capacitor (C) is readilydetermined (e.g., Z = V/I). Knowing the impedance (Z) and the frequency(f), the capacitance (C) can readily be determined (e.g., C =⅟(2*pi*f*Z)).

If the body capacitance between the electrodes is affected by thevoltage 42 and/or current 44 of the body, there will be effects 54detectable by the drive sense circuit of the body surface sensor. Forexample, if the electrodes 32 are positioned near the chest in the heartarea, the voltage 42 that triggers the beating of the heart will becoupled to the impedance network 40. The op-amp 46 continues to regulatethe voltage of the drive signal 52 to match the reference voltage. Assuch, the current produced by the dependent current source 48compensates for the impedance variations of the body capacitor due tothe drive signal and due to the body voltage 42.

Accordingly, the output of the op-amp 46 will include a signal componentfor compensating for body impedance effects 54 on the drive signal 52and a signal component for compensating for the body voltage 42 effectson the impedance, which effects 54 the drive signal. By processing theoutput of the op-amp 46, the capacitance of the body between theelectrodes can be determined and the voltage 42 that stimulates theheart to beat can also be determined.

FIG. 16 is a schematic block diagram of an example of on body surfacesensing via a sensing element within a personal monitoring system 10. Inthis example, a sense element 56 is placed on the surface of the body30. The sense element 56 may be implemented in a variety of ways tosense a variety of conditions. For example, to measure temperature, thesense element 56 is a thermocouple. As another example, to measuremoisture, the sense element 56 is a pad whose impedance varies based onthe level of moisture it absorbs. As yet another example, the senseelement 56 is a transducer whose electrical characteristics vary withvibration of the transducer to detect heart rate, respiration, etc. Asyet another example, the sense element 56 is a variable impendence(e.g., a variable capacitor based on compression) whose impedancechanges with expansion and contraction to measure heart rate,respiration, etc.

The drive sense circuit of a body surface sensor “a” includes thevoltage generator 50, the op-amp 46, and the dependent current source 48and may further includes the feedback circuit (not shown). The drivesense circuit operates as discussed with reference to FIG. 15 . In thisexample, the drive sense circuit senses the impedance of the sensingelement 56 and changes thereto as caused by the body. For example, thetemperature of the body will change the impedance of a thermocouple. Asanother example, the expansion and contraction of the chest from aheartbeat and/or respiration will cause the capacitance ofcompression-based variable capacitor to change.

FIG. 17 is a schematic block diagram of an example of inner body sensingwithin a personal monitoring system 10. In this example, an inner bodysensing transmitter 60 sends a drive signal 52 through a portion of thebody 30 to an inner body sensing receiver 62. The inner body sensingtransmitter 60 includes a drive sense circuit of the op-amp 46, thedependent current source 48, and the voltage reference generator 50. Theinner body sensing receiver 62 includes the op-amp 46, the dependentcurrent source 48, and a DC voltage reference.

The inner body sensing transmitter 60 is coupled to a first electrode 32that is in a first position on the body. The inner body sensing receiver62 is coupled to a second electrode 32 that is in a second position onthe body. The first and second electrodes 32 effectively form plates ofa capacitor and the impedance network 40 of the body provides adielectric of the capacitor.

The inner body sensing transmitter 60 provides drive signal 52 to thefirst electrode, which, in the body, creates an e-field between thefirst and second electrodes 32. With some bodily functions, the bodyvoltage 42 and/or current 44 affect the e-field between the electrodes.The inner body sensing receiver 62 receives the drive signal 52 as acurrent signal and/or a voltage signal, and the effects 54 caused by theimpedance network 40 of the body.

The drive sense circuit of the inner body sensing receiver 62 regulatesthe voltage at the inputs of the op-amp to be equal. Thus, the inputsare regulated to match the DC voltage reference. The op-amp 46 adjuststhe dependent current source 48 to maintain the voltage on the inputsand compensate for the drive signal and the effect 54. The output of theop-amp is processed to determine the effect 54 and its correspondingmeasured body function.

The inner body sensing transmitter and receiver allow for deeper bodysensing than surface sensing based on position of the electrodes 32. Forexample, if one electrode is positioned on one side of the wrist and thesecond electrode is positioned on the other side of the wrist, changesto the body’s impedance 40, body voltages 42, and/or body currents 44 inthe wrist can be accurately measured.

FIG. 18 is a schematic block diagram of an embodiment of an e-fieldsignal receiver 70 that includes an electrode 32, a coupling circuit 72,a DC voltage reference circuit 74, the op-amp 46, the dependent currentsource 48, a feedback circuit 76, and a programmable filter module 78.The DC voltage reference circuit 74 generates a DC reference voltage.There is a variety of known techniques to implement a DC voltagereference circuit 74.

When the e-field signal receiver 70 is operational, the electrode 32receives an inbound e-field signal at a particular tx/rx frequency(e.g., one of the tx/rx frequency sub-band). The electrode 32 will alsolikely receive other signals that are not of interest to the receiver70. Some of these signals will be blocked by coupling circuit 72,example embodiments will be described with reference to FIGS. 19 and 20.

The op-amp 46 functions to match the voltage of its inputs. In thisembodiment, the op-amp regulates the one input to match the DC voltageon the other. via the feedback circuit 76 and the dependent currentsource 48. The feedback circuit 76 may be configured to provide avariety of gain options. For example, the feedback circuit 76 isconfigured to provide a unity gain feedback. As another example, thefeedback circuit 76 is configured to provide a gain greater than 1(e.g., 1.5 x to 10 x). As another example, the feedback circuit 76 isconfigured to provide a pole at a particular frequency. As furtherexample, the feedback circuit 76 is configured to provide a zero at aparticular frequency.

As the op-amp forces its inputs to match, its output represents the ACsignal components of the inbound e-field signal (e.g., the adjustmentsmade to force the inputs to match). The AC signal component at frequencytx/rx_1 is of interest. The other AC signal components are not ofinterest. Accordingly, the programmable filter module 78 is configuredvia receiving parameters 80 to pass, substantially unattenuated, the ACsignal component at frequency tx/rx_1 and to attenuate the other ACsignal components.

The programmable filter module 78 may be implemented as an analog bandpass filter or a digital band pass filter with an analog to digitalconverter front-end. The receiving parameters 80 includes one or moreof: a center frequency (e.g., f_tx/rx (i)), a center frequency gain, alow cut-off frequency, a high cut-off frequency, selectivity, and order(e.g., rate of attenuation outside of band pass region). As an example,an analog band pass filter includes a high pass filter and a low passfilter, each implemented with an op-amp, resistors, and/or capacitors.The resistors and/or capacitors are variable to obtain different low andhigh cut-off frequencies, and gain. Additional resistors and/orcapacitors can be switched into and out of the filters to change theorder and/or selectivity.

A digital band pass filter can be implemented in a variety of ways. Asan example, a digital filter is implemented as one or more infiniteimpulse response (IIR) filters. As another example, the digital filteris implemented as one or more finite impulse response (FIR) filers. Asyet another example, the digital filter is implemented as one or moredecimation filters. As a further example, the digital filter isimplemented as one or more Fast Fourier Transform (FFT) filters. As astill further example, the digital filter is implemented as one or moreInverse Fast Fourier Transform (IFFT) filters.

FIG. 19 is a schematic block diagram of an embodiment of a couplingcircuit 72 that includes an AC coupling capacitor C1 and a low passfilter of resistor R1 and capacitor C2. The AC coupling capacitor is alow impedance at frequencies above 10 KHz, or other frequency, whichallows signals with frequencies above the 10 KHz (or other frequency) topass. The low pass filter allows signals with frequencies below a fewhundred Mega-Hertz (or more, or less) to pass and to attenuate signalshaving higher frequencies.

FIG. 20 is a schematic block diagram of another embodiment of a couplingcircuit 72 that includes an AC coupling capacitor C1 and a highfrequency blocking capacitor C2. The AC coupling capacitor is a lowimpedance at frequencies above 10 KHz, or other frequency, which allowssignals with frequencies above the 10 KHz (or other frequency) to passwith negligible attenuation. The AC blocking capacitor C2 is a lowimpedance at frequencies above a few hundred Mega-Hertz (or more, orless), which shunts high frequency signals to ground.

FIG. 21 is a schematic block diagram of an embodiment of an e-fieldsignal transmitter 90 that includes an electrode 32, a coupling circuit72, the op-amp 46, the feedback circuit 76, the dependent current source48, and a programmable outbound signal generator 92. The programmableoutbound signal generator 92 generates an outbound signal reference 95based on outbound data 96 and in accordance with transmitting parameters94. The transmitting parameters 94 include one or more of, but notlimited to: tx/rx frequency setting, an amplitude setting, an outbounddata modulation scheme, the manner of producing the outbound signalreference 95, filtering parameters, transmit data formatting, and/ortime-division multiplexing time allocations.

In an example, the programmable outbound signal generator 92 receivessensed data from a biometric sensor, a foot force sensor, and/or amarker 22 as outbound data 96. The sensed data is at a sense frequency(e.g., f_sense (i)). The programmable outbound signal generator 92modifies the sensed data to produce the outbound signal reference attx/rx frequency (e.g., f_tx/rx (i)). The programmable outbound signalgenerator 92 will be described in greater detail with reference to oneor more of FIGS. 25 - 28 .

The op-amp 46 functions to match the voltage on it inputs. As such, theoutbound signal reference 95 is provided to the electrode 32 via thecoupling circuit 72. The dependent current source 48 supplies current tothe electrode 32 to maintain the voltage of the op-amp’s input to matchthe outbound signal reference 95 based on the load of the electrode 32.

FIG. 22 is a schematic block diagram of an embodiment of body surfacesensor 100 (type “a”). The body surface sensor 100 includes a pair ofelectrodes 32, a coupling circuit 72, a programmable sense signalgenerator 102, an op-amp 46, a feedback circuit 76, a dependent currentsource 48, and a programmable filter module 104. The programmable sensesignal generator 102 and the programmable filter module 104 areprogrammed based on sensing parameters 106.

The sensing parameters 106 include filter settings and sense signalsettings. The filter settings include a center frequency, a lowfrequency cut-off, a high frequency cut-off, a center frequency gain,selectivity, and/or order (e.g., rate of attenuation outside of bandpass region). The sense signal settings include a frequency, a signalform (e.g., sine wave, square wave, etc.), magnitude, and/or phaseshift.

Based on the sense signal settings, the programmable sense signalgenerator 102 generates a sense signal 105, which has a frequency atf_sense (i) in the e-field frequency band. The programmable sense signalgenerator 102 will be described in greater detail with reference to oneor more of FIGS. 25 and 26 .

The op-amp 46 functions to keep the voltage at its inputs matching.Accordingly, the voltage of the drive sense (D-S) signal substantiallyequals the voltage of the sense signal 105. The dependent current source48 supplies a current that varies based on the output of the op-amp 46and the feedback circuit 76 to keep the input voltages of the op-ampsubstantially matching. Via the coupling circuit 72 and the firstelectrode 32, the drive-sense signal is sourced to the body 30.

The current produced by the dependent current source 48 flows through aportion of the body’s impedance network (the part between the electrodes32). The portion of the body’s impedance network affects the drive-sensesignal 103. For example, the capacitance of the portion of the body’simpedance network has an impedance at the sense frequency (f_sense (i)).Since I (current) = V (voltage) / Z (impedance), the current of drivesignal is affected by the body’s impedance. The effect of the body’simpedance is regulated out of the voltage of the drive-sense voltage bythe op-amp. The amount of regulation is reflected in the output of theop-amp 46. Thus, the output of the op-amp 46, via the regulated effect,represents a measure of the body’s impedance.

As another example, the surface of the body between the electrodes 32 isaffected by the impedance of the body and by an electrical signal of thebody (e.g.., the electric signal that causes the heart to beat). Theelectrical signal of the body is coupled into the capacitance of thebody between the electrodes 32. The coupled electrical signal affectsthe impedance of the body’s capacitance between the electrodes 32, whichis sensed as discussed in the previous paragraph.

The output of the op-amp 46 is filtered by the programmable filtermodule 104, which outputs sensed data at the sense frequency, orfrequencies). The programmable filter module 104 (which is aprogrammable analog bandpass filter and/or a programmable digitalbandpass filter) is programmed to pass, substantially unattenuated,signals having a frequency approximate to the sense frequency and toattenuate signals having frequencies that do not approximate the sensefrequency.

The programmable filter module 104 may further be programmed to have asecond bandpass region. For example, if the body surface sensor 100 issensed heart rate, the programmable filter module 104 is programmed witha second bandpass region of 200 Hz or less to pass the sensed electricalsignal that triggers the heart to beat.

FIG. 23 is a schematic block diagram of an embodiment of body surfacesensor 100-b that includes or is coupled to a sensing element 56. Thesensor 100-b is similar to the sensor 100-a of FIG. 22 with theexceptions that the present sensor does not include the electrodes 32and it is sensing the sensing element 56, not the body. For example, thesensor 100-b senses the surface temperature of the body; moisture of thesurface of the body; movements of the body; and/or other bodilycondition.

A bodily condition (e.g., temperature) affects the impedance of thesense element 56. The sensor 100-b detects the effect of the impedanceof the sense element via effects on the drive-sense signal 103. Sucheffects are reflected in the output of the op-amp 46 and subsequentlyfilter by the programmable filter module 104 to produce sensed data.Note that sensed data is an analog signal or a digital signal that isrepresentative of the effect on the drive-sense signal 103, which iscaused by a bodily condition.

FIG. 24 is a schematic block diagram of an embodiment of an inner bodysurface sensor that includes an inner body sensing transmitter 60 and aninner body sensing receiver 60. The inner body sensor provides sensesignals deeper into the body to measure a bodily condition within thebody. Alternatively, or in addition, the inner body sensor senses abodily condition on the surface of the body. In another embodiment, theinner body sensor includes one or more inner body sensing transmitters60 and a plurality of inner body sensing receivers 62.

The inner body sensing transmitter 60 includes an electrode 32, acoupling circuit 72, a programmable sense signal generator 102 (which isconfigured in accordance with sensing parameters 106), an op-amp 46, afeedback circuit 76, and a dependent current source 48. These componentsoperate as previously discussed to produce a drive-sense signal 103. Inthis sensor, the sensing of the effects on the drive-sense signal 103 isdone by the inner body sensing receiver 62.

The inner body sensing receiver 62 includes an electrode 32, a couplingcircuit 72, a DC voltage reference circuit 74, an op-amp 46, a feedbackcircuit 76, a dependent current source 48, and a programmable filtermodule 104 (which is configured in accordance with the sensingparameters). With a DC voltage reference, the AC components regulatedout at the input of the op-amp correspond to the drive-sense signal 103and the effects on it caused by the body 30. The effects caused by thebody are reflected in the sensed data being outputted.

FIG. 25 is a schematic block diagram of an example of a relationshipbetween ID frequencies, sensing frequencies, & e-field communicationfrequencies within a personal monitoring system. As mentioned, eachpersonal monitoring system is assigned a system ID frequency (e.g.,f_sys ID).

In an embodiment, the system ID frequency is permanently assigned to apersonal monitoring system. Note that, with a limited number ofavailable system ID frequencies, some personal monitoring systems willbe assigned the same system ID frequency. As long as the users ofpersonal monitoring systems with the same system ID frequency are not ina physically close proximity in which the users may physically toucheach other, then having the same system ID frequency will not be anissue.

Recall that, in an embodiment, the communication device generates asystem ID signal using the system ID frequency and transmits the systemID signal through the body to sensors associated with the body. Thesensors incorporate a representation of the system ID signal in theirresponses such that the communication device knows the sensors areassociated with the body and the present personal monitoring system.

In another embodiment, the computing device randomly assigns the systemID frequency to the personal monitoring. For example, when a pluralityof users are in a confined physical area (e.g., a football field, abasketball court, a starting position for a running race, a workoutclass, etc.), there is a probability that the users will touch. When twousers physically touch, or are close to touching (e.g., within 10centimeters or more), the e-field signals of one body may be received bythe other body, and vice versa. If the system ID frequencies are thesame, the personal monitoring systems cannot tell which body the signalsare from.

To overcome this potential issue, the computing device allocates thepersonal monitoring systems in the confined physical area a uniquesystem ID frequencies. For example, for a basketball game, each player’spersonal monitoring system would be allocated a unique system IDfrequency for the game. As another example, for a marathon, orhalf-marathon, race, each participant is the race is assigned a uniquesystem ID frequency for the race.

In furtherance of the present embodiment, once the game or race is over,the personal monitoring system retains the assigned system ID frequencyunit the next use of the system in a confined physical area.Alternatively, once the game or race is over, the personal monitoringsystem is assigned a new system ID frequency.

In yet another embodiment, the computing device temporary assigns asystem ID frequency to the personal monitoring for a particular use. Forexample, a personal monitoring system has a permanently assigned systemID frequency but, for particular situations, it assigned a temporarysystem ID frequency. As a specific example, for the basketball game orthe marathon race, a user’s personal monitoring system is assigned aunique temporary system ID frequency (which may corresponds to itspermanent system ID frequency) to use for the duration of the gameand/or race. Once the game or race is over, the personal monitoringsystem resumes use of its permanently assigned system ID frequency.

As further shown in FIG. 25 , the programmable sense signal generator102 uses the system ID frequency in accordance with the sensingparameters 106 to produce a sensing signal at a particular sensingfrequency. Within a personal monitoring system, sensors are assignedunique sensing frequencies, which are used to identify the sensors andto enable concurrent sensing of the body.

FIG. 26A is a schematic block diagram of an embodiment of a programmablesense signal generator102 that includes a system ID signal source 122, asense offset signal source 120, a multiplier 124, and a programmablebandpass filter 126. The system ID signal source 122 generates a systemID sinusoidal signal having a frequency of the system ID frequency,which can be done in a variety of ways.

For example, the system ID signal source 122 is a bandpass filtercentered at the system ID frequency and recovers the system ID signalfrom an e-field transmission by the communication device through thebody. As another example, the system ID signal source 122 is a crystaloscillator that is configured to generate the system ID signal. In thisexample the system ID frequency is stored as a digital value in memoryof the sensor. As yet another example, the system ID signal source 122is a digital frequency synthesizer that is programmed to generate thesystem ID signal having the system ID frequency.

The sense offset signal source 120 generates an offset sinusoidal signalhaving an offset frequency. The sense offset signal source 120 may beimplemented in a similar manner as the system ID signal source 122.

The sinusoidal system ID signal (e.g., sin (f_sys ID)t) is multipliedwith the sinusoidal offset signal (e.g., cos (f_offset (i))t) to producea mixed signal (e.g., ½ sin (f_sys ID - f_offset (i))t + ½ sin (f_sysID + f_offset (i))t). The programmable bandpass filter (BPF) 126 isprogrammed to pass, substantially unattenuated, the sum of thefrequencies signal component (e.g., ½ sin (f_sys ID + f_offset (i))t) orthe difference of the frequencies signal component (½ sin (f_sys ID -f_offset (i))t) and to attenuate signals having frequencies outside ofthe bandpass region. The output of the programmable bandpass filter 126is a sense data reference signal 105, which is used by a sensor to sensedata and/or to identify the sensor.

FIG. 26B is a schematic block diagram of another embodiment of aprogrammable sense signal generator102 that includes the system IDsignal source 122 and a phase locked loop 125. The system ID signalsource 122 generates a sinusoidal system ID signal (e.g., sin (f_sysID)t), which is inputted to the phase locked loop 125. Based on thedesired sense frequency (e.g., the system ID frequency + the senseoffset frequency), the phase locked loop 125 generates the sense datareference signal 105.

FIG. 26C is a schematic block diagram of another embodiment of aprogrammable sense signal generator 102 that includes a digitalfrequency synthesizer 135. Based on the input of the system ID frequencyand the sense offset frequency, the digital frequency synthesizer 135generates the sense data reference signal 105.

Returning to the discussion of FIG. 25 , the programmable outboundsignal generator 92 generates an outbound e-field signal 95 based on thesense data and the transmit parameters 94. The outbound e-field signal95 has a sinusoidal signal component a tx/rx frequency (e.g., f_tx/rx(i)).

FIG. 27A is a schematic block diagram of an embodiment of a programmableoutbound signal generator 92 comprises a transmit (TX) formatting module130, a tx/rx signal generator 134, a multiplier 132, and a band passfilter 138. The TX formatting module 130 receives an outbound datasignal from a sensor, from a marker, and/or from the communicationdevice. The outbound data signal is sensed data, information (e.g., setup information, a command, the system ID, etc.) from the communicationdevice to a sensor, an information response from a sensor to thecommunication device, and/or other data sent via the body within theperson monitoring system. In this example, the outbound data is senseddata at a frequency of f_sense (i).

The TX formatting module 130 adjusts, in accordance with thetransmitting parameters 94, the outbound data signal for multiplying itwith the tx/rx offset signal at f_tx/rx offset (i) by multiplier 132.The adjusting of the outbound data signal includes one or more of:converting the outbound data signal into a digital signal; adjusting theamplitude of the signal; adjusting the phase of the signal; modulatingthe data via a modulation protocol (e.g., AM (amplitude modulation), ASK(amplitude shift keying), and/or PSK (phase shift keying)), and/or timeshifting the signal.

The tx/rx signal generator 134 generates, in accordance with thetransmitting parameters 94, a tx/rx offset signal at a frequency off_tx/rx offset (i). FIG. 27B is a schematic block diagram of anembodiment of a programmable tx/rx signal generator 134 that includes afirst signal source 140, a second signal source 142, a third signalsource 144, and a multiplexer (mux).

The first signal source 140 generates a second offset signal (e.g., cos(f_offset_2 (i)t) based on a second offset frequency setting. The secondsignal source 142 generates the system ID signal (e.g., cos (f_sys ID(i)t) based on a system ID frequency setting. The third signal source144 generates a first offset signal (e.g., cos (f_offset_1 (i)t, i.e.,the offset used to produce the sense frequency) based on a first offsetfrequency setting. The multiplexor selects one of the signals tofunction as the tx/rx offset signal.

Alternatively, the tx/rx signal generator 134 includes one signal sourcethat is programmable to produce one of the three signals as the tx/rxoffset signal. For example, the signal source is programmed to producethe second offset signal (e.g., cos (f_offset_2 (i)t). As anotherexample, the signal source is programmed to produce the system ID signal(e.g., cos (f_sys ID (i)t). As yet another example, the signal source isprogrammed to produce the first offset signal (e.g., cos (f_offset_1(i)t. The signal source(s) of FIG. 27B may be implemented in a similarmanner as the system ID signal source 122 of FIG. 26B.

Returning to the discussion of FIG. 27A, the multiplier 132 multiplesthe outbound data signal (e.g., sin (f_sense (i)t) and the tx/rx offsetsignal (e.g., cos (f_tx/rx offset (i)t) to produce a mixed signal 136.The mixed signal 136 includes a sum of the frequencies component (e.g.,½ sin (f_sense(i) + f_tx/rx offset (i)t) and a difference of thefrequencies component (e.g., ½ sin (f_sense(i) - f_tx/rx offset (i)t).

The bandpass filter 138 is programmed based on the transmittingparameters to pass the sum of the frequencies component (e.g., ½ sin(f_sense(i) + f_tx/rx offset (i)t) or the difference of the frequenciescomponent (e.g., ½ sin (f_sense(i) - f_tx/rx offset (i)t) as theoutbound e-field signal 95. The outbound e-field signal 95 istransmitted via the body and received by the desired destination (e.g.,a sensor, a market, and/or the communication device).

FIGS. 28A - 28D are diagrams of example signals within the personalmonitoring system 10. When the personal monitoring system 10 is coupledto a body, signaling via the body is done using e-field analog signals;examples of which are shown in FIGS. 28A and 28C. The example analogsignals have a frequency that identifies the source of the signal. Thedata being conveyed via the analog signal is contained in the amplitudeof the signal (e.g., AM, ASK, etc.) and/or in the phase shifting of thesignal (e.g., PSK).

FIGS. 28B and 28D illustrate digital representations of the analogsignals of FIGS. 28A and 28C, respectively. The circuity of the personalmonitoring system 10 is implemented in the analog domain to process theanalog signals of FIGS. 28A and 28C and/or is implemented in the digitaldomain to process the digital signals of FIGS. 28B and 28D.

FIG. 29 is a schematic block diagram of an embodiment of a fully passivepower source module 150 that includes an RF power harvesting circuit 154and a DC-to-DC converter 156. The RF power harvesting circuit 154 iscoupled to an antenna 152 and receives RF signals therefrom. The RFpower harvesting circuit 154, using a conventional implementation,converts the received RF signals into an unregulated DC voltage.

The DC-to-DC converter 156 converts the unregulated DC voltage of thepower harvesting circuit 154 into one or more regulated supply voltages158. The DC-to-DC converter 156 is implemented as a linear regulation,as a buck-converter, as a boost-converter, and/or other DC-to-DCconverter topologies.

The power source module 150 may further include one or more other powerharvesting circuits. For example, the power source module 150 includes apressure-based power harvesting circuit where varying pressure isconverted into a voltage. As another example, the power source module150 includes a light harvesting power module (e.g., one or more solarcells). As yet another example, the power source module 150 includes aheat-based harvesting module where heat of the user of the personalmonitoring system is converted into a voltage. The output of anadditional power harvesting circuit is coupled to the input of theDC-to-DC converter 156.

FIG. 30 is a schematic block diagram of another embodiment of a passiveassist power source module 150 that includes the RF power harvestingcircuit 154, the DC-to-DC converter 156, a battery 160, and blockingdiodes 162 and 164. The RF power harvesting module 154 is coupled toantenna 154. The blocking diodes 162 and 164, which may be Schottkydiodes or other one-direction current flow circuit, decouple the batteryand the RF power harvesting circuit and allow the one generating thehigher voltage to supply the DC-to-DC converter, which produces one ormore supply voltages 158.

FIG. 31 is a schematic block diagram of another embodiment of a passiveassist power source module 150 that includes the RF power harvestingcircuit 154, the DC-to-DC converter 156, a battery 160, a batterycharger 166, a first switch 168, and a second switch 170. With thisembodiment of a power source module 150, power is being supplied by theRF power harvesting circuit 154 or by the battery 160. When the battery160 is supplying the power, switch 168 is open and switch 170 couplesthe battery to the DC-to-DC converter 156.

When the RF power harvesting circuit 154 is supplying the power, switch170 couples the RF power harvesting module 154 to the DC-to-DC converter156. In addition, switch 168 may be closed to enable charging of thebattery 160 by the battery charger 166. In another mode, switch 170 isopen (i.e., no input to the DC-to-DC converter 156) and switch 168 isclosed to allow charging of the battery when the power source module 150is producing the one or more supply voltages 158.

FIG. 32 is a schematic block diagram of an embodiment of a communicationdevice 12 that includes a core control module 180, an external wirelesscommunication module 182 (which is coupled to an antenna 152), aprocessing module 184, memory 186, an e-field signal transmitter 90, ane-field signal receiver 70, electrodes 32, a battery 192, a batterycharger 194, a power management module 188, a video graphics processingmodule 200, a display 202, a touch controller 204, one or more touchsensors 206, one or more Input/Output (I/O) interfaces 208, one or moreinput and/or output components 210, an internal RFID communicationmodule 212 (which is coupled to antenna 214), and an internal 60 GHzcommunication module 216 (which is coupled to antenna 218). The corecontrol module 180, the processing module 184, the video graphicsprocessing module 200, the display 202, the touch controller 204, thetouch sensor(s) 206, the I/O interface(s) 208, and the I/O component(s)210 function as described in one or more of the parent patentapplications.

The memory 186 includes one or more of: main memory, a read only memory(ROM) for a boot up sequence, cache memory 47, tier three memory, and/orcloud memory. The main memory includes one or more Random Access Memory(RAM) integrated circuits, or chips. For example, a main memory includesfour DDR4 (4^(th) generation of double data rate) RAM chips, eachrunning at a rate of 2,400 MHz. The tier three memory includes one ormore hard drives, one or more solid state memory chips, and/or one ormore other large capacity storage devices that, in comparison to cachememory and main memory devices, is/are relatively inexpensive withrespect to cost per amount of data stored.

The e-field transmitter 90, which is coupled to an electrode 32, allowsthe communication device 12 to transmit e-field signals to the biometricsensors 14, a foot force sensing unit 18, a personal coordinate unit 20,and/or a body position/motion marker 22. For example, the communicationdevice 12 transmits a system ID signal as an e-field signal. As anotherexample, the communication device 12 transmits a set up signal, as ane-field signal, to one or more sensors 14, to one or more foot forcesensors 18, to the personal coordinate system 20, and/or to one or moremarkers 22. As a further example, the communication device 12 transmitsdata and/or information regarding the system, its operation, formattingof data, etc., as an e-field signal to one or more components (e.g., 14,18, 20, and/or 22) of the system 10.

The e-field signal receiver 70, which is coupled to an electrode 32,allows the communication device 12 to receive data from a biometricsensor 14, a foot force sensing unit 18, a personal coordinate unit 20,and/or a body position/motion marker 22. For example, a biometric sensor14 sends sensed data (e.g., an analog signal represented a sample of aheartbeat, of a breath, of temperature, etc.) as an e-field signal tothe communication device 12. As another example, a foot force sensingunit 18 sends foot force data (e.g., an analog signal representing acapacitance and/or a pressure value corresponding to the capacitance) asan e-field signal to the communication device 12. As yet anotherexample, the personal coordinate unit 20 sends body position data (e.g.,an analog signal regarding a position of a marker within a personalcoordinate system, or the distances to it) as an e-field signal to thecommunication device 12.

The external wireless communication module 182 is of a known design toprovide Bluetooth communication, ZigBee communication, WLANcommunication, cellular data communication, and/or other standardizedwireless communication. Accordingly, the external wireless communicationmodule 182 enables the communication device 12 to communicate with thecomputing device 24. In an example, the communication device 12 sendsthe data it receives from the biometric sensors 14, the foot forcesensing units 18, and/or the personal coordinate unit 20 to thecomputing device for processing. In another example, the communicationdevice 12 receives set up information from the computing device 24.

The 60 GHz communication module 216 is a transceiver that allows thecommunication device 12 to communicate in the 28 GHz band and/or the 60GHz band with components of the system 10 (e.g., the biometric sensors14, the foot force units 18, the personal coordinate unit 20, and/or themarkers 22). For example, the communication device 12 facilitates bodyposition and/or body motion data gathering from the markers 22.

The internal RFID communication module 212 is implemented as an RFIDreader. This enables the communication device 12 to communicate with thebiometric sensors 14, the foot force units 18, the personal coordinateunit 20, and/or the markers 22, provided they include an RFIDtransceiver.

The power management unit 188 includes one or more DC-to-DC converters,a battery monitoring circuit, a voltage surge protection circuit, anover current protection circuit, and/or a power coupling circuit. Thepower management unit 188 generates one or more supply voltages 190 froma battery voltage and/or from an input voltage (e.g., a USB input supplyvoltage). The power management unit 188 individually provides one ormore of the supply voltages 190 to various components of thecommunication device as needed to converse power.

FIG. 33 is a schematic block diagram of another embodiment of acommunication device 12 that includes a core control module 180, anexternal wireless communication module 182 (which is coupled to anantenna 152), a processing module 184, memory 186, an e-field signaltransmitter 90, an e-field signal receiver 70, electrodes 32, a battery192, a battery charger 194, and a power management module 188. Thesecomponents function as described with reference to FIG. 32 .

FIG. 34 is a schematic block diagram of another embodiment of acommunication device 12 that includes a core control module 180, anexternal wireless communication module 182 (which is coupled to anantenna 152), a processing module 184, memory 186, an e-field signaltransmitter 90, an e-field signal receiver 70, electrodes 32, a battery192, a battery charger 194, a power management module 188, a videographics processing module 200, and a display 202. These componentsfunction as described with reference to FIG. 32 .

FIG. 35 is a schematic block diagram of another embodiment of acommunication device 12 that includes a core control module 180, anexternal wireless communication module 182 (which is coupled to anantenna 152), a processing module 184, memory 186, an e-field signaltransmitter 90, an e-field signal receiver 70, electrodes 32, a battery192, a battery charger 194, a power management module 188, a videographics processing module 200, a display 202, a touch controller 204,and one or more touch sensors 206. These components function asdescribed with reference to FIG. 32 .

FIG. 36 is a schematic block diagram of another embodiment of acommunication device 12 that includes a core control module 180, anexternal wireless communication module 182 (which is coupled to anantenna 152), a processing module 184, memory 186, an e-field signaltransmitter 90, an e-field signal receiver 70, electrodes 32, a battery192, a battery charger 194, a power management module 188, a videographics processing module 200, a display 202, a touch controller 204,one or more touch sensors 206, one or more Input/Output (I/O) interfaces208, and one or more input and/or output components 210. Thesecomponents function as described with reference to FIG. 32 .

FIG. 37 is a schematic block diagram of another embodiment of acommunication device 12 that includes a core control module 180, anexternal wireless communication module 182 (which is coupled to anantenna 152), a processing module 184, memory 186, an e-field signaltransmitter 90, an e-field signal receiver 70, electrodes 32, a battery192, a battery charger 194, a power management module 188, a videographics processing module 200, a display 202, a touch controller 204,one or more touch sensors 206, one or more Input/Output (I/O) interfaces208, one or more input and/or output components 210, and an internalRFID communication module 212 (which is coupled to antenna 214). Thesecomponents function as described with reference to FIG. 32 .

FIG. 38 is a schematic block diagram of another embodiment of acommunication device 12 that includes a core control module 180, anexternal wireless communication module 182 (which is coupled to anantenna 152), a processing module 184, memory 186, an e-field signaltransmitter 90, an e-field signal receiver 70, electrodes 32, a battery192, a battery charger 194, a power management module 188, a videographics processing module 200, a display 202, a touch controller 204,one or more touch sensors 206, one or more Input/Output (I/O) interfaces208, one or more input and/or output components 210, and an internal 60GHz communication module 216 (which is coupled to antenna 218). Thesecomponents function as described with reference to FIG. 32 .

FIG. 39 is a schematic block diagram of another embodiment of acommunication device 12 that includes a core control module 180, anexternal wireless communication module 182 (which is coupled to anantenna 152), a processing module 184, memory 186, a battery 192, abattery charger 194, a power management module 188, a video graphicsprocessing module 200, a display 202, a touch controller 204, one ormore touch sensors 206, one or more Input/Output (I/O) interfaces 208,one or more input and/or output components 210, an internal RFIDcommunication module 212 (which is coupled to antenna 214), and aninternal 60 GHz communication module 216 (which is coupled to antenna218). These components function as described with reference to FIG. 32 .

FIG. 40 is a schematic block diagram of an embodiment of a biometricsensor 220 that includes a power source module 120, an antenna 152, oneor more electrodes 32, a body surface sensor 100-a, a processing module222, memory 224, an e-field signal transmitter 90, an e-field signalreceiver 70, and an analog to digital converter (ADC). The biometricsensor 220 may be implemented in a variety of ways. For example, thebody surface sensor 100-a, the processing module 222, the memory 224,the e-field signal transmitter 90, the e-field signal receiver 70, andthe ADC are implemented on an integrated circuit (IC). The IC, theelectrodes 32, and the antenna 152 are mounted on one or more flexiblePCBs (e.g., cloth, plastic, etc. printed circuit board) that includes anadhesive for adhering to the body 30.

In an embodiment, the antenna 152 and an electrode 32 are combined tointo an antenna/electrode unit, which will be discussed in greaterdetail with reference to one or more of FIGS. 51 - 58E. In theembodiment and/or another embodiment, the biometric sensor includes moreor less than two electrodes. For example, the biometric sensor 220includes four electrodes; two for the body surface sensor 100, one forthe e-field signal transmitter 90, and one for the e-field signalreceiver 70. As another example, the biometric sensor 220 includes threeelectrodes; two for the body surface sensor 100 and one for the e-fieldsignal transmitter 90 and the e-field signal receiver 70.

In an example of operation, the power harvesting module 150 functions toproduce one or more supply voltages 158 as previously discussed. Whenthe supply voltage(s) 158 is/are available, the other circuitry of thebiometric sensor 220 is active.

With available power, the e-field signal receiver 70 receives inbounde-field signals from the body via an electrode. The inbound e-fieldsignals are transmitted by the communication device 12 and are regardingsystem set up, a request for data, a change in the system set up, arequest for a diagnostic analysis, and/or a request for diagnosticinformation. For example, during set up, the inbound data includes thesystem ID frequency (f_sys ID). The inbound data further includes one ormore sensing frequencies (or one or more offset frequencies to determinethe one or more sensing frequencies) for use by the body surface sensor.The inbound data still further includes one or more e-field transmitfrequencies (or one or more transmit offset frequencies to determine theone or more e-field transmit frequencies) for use by the e-field signaltransmitter 90.

The e-field signal receiver 70, which is configured in accordance withreceiving parameters 80, converts the inbound e-field signals into oneor more inbound signals at a tx/rx frequency as previously discussed.The ADC converts the one or more inbound signals into digital input data226 and provides it to the processing module 222. The processing module222 processes the input data 226 to produce the sensing parameters 106,the transmitting parameters 94, and the receiving parameters 80. Notethat, the processing module 222 generates default receiving parameters80 to receive initial set up information.

The body surface sensor 100 is configured in accordance with the sensingparameters 106 to sense a condition of the body 30. As previouslydiscussed, the body surface sensor 100 generates sensed data at the oneor more sense frequencies (f_sense (i)). The e-field signal transmitter90 receives the sensed data as outbound data, converts it into anoutbound e-field signal at one or more transmit frequencies (f_tx/rx(i)), and transmits the outbound e-field signal to the communicationdevice 12 via an electrode 32 and the body 30.

FIG. 41 is a schematic block diagram of another embodiment of abiometric sensor; 220 that is similar to the biometric sensor 220 ofFIG. 40 with the differences of this embodiment includes body surfacesensor “b” 100-b, which is coupled to a sensing element 56 via theelectrodes 32. The body surface sensor “b” 100-b functions as previouslydiscussed to produce sensed data based on the response of the senseelement 56 to a condition of the body (e.g., temperature). The senseddata of the sensor element 56 is conveyed to the communication device 12via the e-field transmitter 90, an electrode 32, and the body 30.

FIG. 42 is a schematic block diagram of another embodiment of abiometric sensor 220 that is similar to the biometric sensor of FIG. 40and/or 41. In this embodiment, the biometric sensor 220 does not includean e-filed receiver 70. Further, the input data is programmed into theprocessing module 222 and/or stored in memory 224 at some point prior toincorporation of the sensor 220 into a personal monitoring system. In analliterative embodiment, sensors of the personal monitoring system usethe same sense frequency and the same e-field transmit frequency, wherethe sensors are enabled in a time division multiplexed access (TDMA)manner.

FIG. 43 is a schematic block diagram of another embodiment of abiometric sensor 220 that includes a body surface sensor “a” and/or “b”100, electrodes 32, the power source module 150, the antenna 152, theprocessing module 222, the memory 224, an RF receiver 230, and an RFtransmitter 232. In an embodiment, the RF receiver 230 and the RFtransmitter 232 are configured to communicate with the communicationdevice 12 in accordance with an RFID communication protocol. As such,the biometric sensor 220 is the equivalent of an RFID tag and thecommunication device is the equivalent of an RFID reader within thepersonal monitoring system. In an alternate embodiment, the RF receiver230 and the RF transmitter 232 are configured to communicate with thecommunication device 12 in accordance with a 60 GHz personal areanetwork communication protocol.

In either embodiment, the RF receiver 230 functions to receive the inputdata 226 for the biometric sensor 220 and provides it to the processingmodule 222. The RF transmitter 232 functions to transmit the sensed datato the communication device 12.

FIG. 44 is a schematic block diagram of another embodiment of abiometric sensor 220 that includes a body surface sensor “a” and/or “b”100, electrodes 32, the power source module 150, the antenna 152, theprocessing module 222, the memory 224, an RF receiver 230, and ane-field signal transmitter 90. In this embodiment, the RF receiver 230functions to receive the input data 226 for the biometric sensor 220 andprovides it to the processing module 222. The e-field signal transmitter90 functions to transmit the sensed data to the communication device 12.

FIG. 45 is a schematic block diagram of another embodiment of abiometric sensor 220 that includes a body surface sensor “a” and/or “b”100, electrodes 32, the power source module 150, the antenna 152, theprocessing module 222, the memory 224, an e-field signal receiver 70,and an RF transmitter 232. In this embodiment, the e-field signalreceiver 70 functions to receive the input data 226 for the biometricsensor 220 and provides it to the processing module 222. The RFtransmitter 232 functions to transmit the sensed data to thecommunication device 12.

FIG. 46 is a schematic block diagram of another embodiment of abiometric sensor 240 that includes electrodes 32, an inner body sensingtransmitter 60, an inner body sensing receiver 62, an e-field signaltransmitter 90, a power source module 150, a processing module 222, andmemory 224. The processing module 222 and/or the memory 224 obtain thesensing parameters 106 and the transmitting parameters 94 viaprogramming prior to the biometric sensor 240 becoming part of apersonal monitoring system. For instance, biometric sensors areprogrammed to use the same sensing frequency and the same e-fieldtransmitting frequency where the personal monitoring system enables thesensors of the system in a TDMA manner.

When the inner body sensing transmitter 60 transmits a sense signal at asensing frequency (e.g., f_sense (i)) via an electrode 32, the sensesignal is transmitted via the body to the inner body sensing receiver62. The inner body sensing receiver 62 generates sensed data aspreviously discussed and provides it to the e-field signal transmitter90. The e-field signal transmitter 90 converts the sensed data into anoutbound e-field signal at a transmit frequency (e.g., f_tx/rx (i)) thatit transmits to the communication device 12 via the body 30.

FIG. 47 is a schematic block diagram of another embodiment of abiometric sensor 240 that is similar to the biometric sensor of FIG. 46. In this embodiment, the biometric sensor includes an e-field signalreceiver 70 and an ADC to receive inbound e-field signals from thecommunication device 12 and to produce, therefrom, input data 226. Theprocessing module 222 generates the sensing parameters 106, thetransmitting parameters 94, and/or the receiving parameters 80 from theinput data 226 as previously discussed.

FIG. 48 is a schematic block diagram of another embodiment of abiometric sensor 240 is similar to the biometric sensor 220 of FIG. 43 .In this embodiment, the biometric sensor 240 includes the inner bodysensing transmitter 60 and the inner body sensing receiver 62 instead ofthe body surface sensor “a” and/or “b” 100.

FIG. 49 is a schematic block diagram of another embodiment of abiometric sensor 240 is similar to the biometric sensor 240 of FIG. 47 .In this embodiment, the biometric sensor 240 includes a second innerbody sensing receiver 62, which is configured to receive a sense signalat a second sense frequency (e.g., f_sense (i + 1)) and the first innerbody sensing receiver 62 receives a sense signal at a first sensefrequency (e.g., f_sense (i)).

A first body impedance between the electrodes of the inner body sensingtransmitter and the first inner body sensing transmitter will bedifferent than a second body impedance between the electrodes of theinner body sensing transmitter and the second inner body sensingtransmitter. In addition, the body voltage and/or current effect on thefirst and second impedances is captured by the first and second innerbody sensing receivers to aid in interpreting a condition of the body(e.g., heart rate, blood flow, respiration, etc.).

FIG. 50 is a schematic block diagram of another embodiment of abiometric sensor that includes a transmit (TX) biometric sensor 244 anda receive (RX) biometric sensor 242. The TX biometric sensor 244includes an electrode 32, an inner body sensing transmitter 60, ane-field signal receiver 70, a power source module 150, an ADC, aprocessing module 222, and memory 224.

The RX biometric sensor 242 includes an electrode 32, an inner bodysensing receiver 62, an e-field signal receiver 70, an e-field signaltransmitter 90, a power source module 150, an ADC, a processing module222, and memory 224. This embodiment allows for greater separationbetween the electrodes 32 associated with the inner body sensingtransmitter 60 and receiver 62. In furtherance of this embodiment, theTX biometric sensor 244 transmits sensing signals to a plurality of RXbiometric sensors 242 using different frequencies for the sensingsignals or using the same frequency and a TDMA communication with the RXbiometric sensors 242.

FIG. 51 is a schematic block diagram of an embodiment of a foot forcesensing cell unit 225 that includes a foot force sensor die 250, anelectrode/antenna 252, an insulator, electrodes 32, and a variablecapacitor (C1). The foot force sensor die 250 includes an e-field signalreceiver 70, an e-field signal transmitter 90, a body surface sensor “b”100, a power source module 150, an ADC, a processing module 222, andmemory 224.

When compressed, the capacitance of the capacitor C1 varies. Forinstance, when foot force is applied to the capacitor, its capacitancechanges. The foot force sensor die 250 measures impedance of thecapacitance of C1 as it varies due to varying levels of applied footforces (e.g., varies when walking, running, etc.). The die 250 providesthe varying impedance of the die as an outbound e-field signal to thecommunication device 12.

The communication device 12 and/or the computing device 24, processingthe impedance data of the varying capacitor to first determine thecapacitance values represented by the impedance data. From thecapacitance values, the communication device 12 and/or the computingdevice 24 determines the applied foot forces based on the capacitancevalues.

FIG. 52 is a schematic block diagram of another embodiment of a footforce sensing cell unit 225 that includes a foot force sensor die 260,an electrode/antenna 252, an insulator 256, three electrodes (E1 - E3),three capacitors (C1 - C3), and a shared common electrode 32. The footforce sensor die 260 includes an e-field signal receiver 70, an e-fieldsignal transmitter 90, three body surface sensors “b” 100 (one for eachcapacitor), a power source module 150, an ADC, a processing module 222,and memory 224.

In this embodiment, the impedance of each of the three capacitors issensed using individual sensing signals, each having its own sensefrequency. For example, C1 is sensed by a first body surface sensor 100that uses a first sensing signal at a first sensing frequency (e.g.,f_sense (i)); C2 is sensed by a second body surface sensor 100 that usesa second sensing signal at a second sensing frequency (e.g., f_sense(i + 1)); and C3 is sensed by a third body surface sensor 100 that usesa third sensing signal at a third sensing frequency (e.g., f_sense (i +2)).

Each of the sensed signals is transmitted by the e-field signaltransmitter 90 using three e-field transmit frequencies. For example,the sensed data of the first capacitor at f_sense (i)) is transmittedusing tx/rx frequency of f_tx/rx (i)); the sensed data of the secondcapacitor at f_sense (i + 1)) is transmitted using tx/rx frequency off_tx/rx (i + 1)); and the sensed data of the third capacitor at f_sense(i + 2)) is transmitted using tx/rx frequency of f_tx/rx (i + 2)).

FIG. 53 is a schematic block diagram of another embodiment of a footforce sensing cell unit 225 that includes a foot force sensor die 270,an electrode/antenna 252, an insulator 256, three electrodes (E1 - E3),three capacitors (C1 - C3), and a shared common electrode 32. The footforce sensor die 270 includes an e-field signal receiver 70, an e-fieldsignal transmitter 90, a body surface sensor “b” 100, a power sourcemodule 150, an ADC, a processing module 222, memory 224, and aTDMA-based multiplexer 272.

In this embodiment, the impedance of each of the three capacitors issensed using a sensing signal that has the same frequency in a TDMAmanner. For example, C1 is sensed by the body surface sensor 100 using asensing signal at a sensing frequency (e.g., f_sense (i)) during a firsttime interval; C2 is sensed by the body surface sensor 100 using thesensing signal at the sensing frequency (e.g., f_sense (i)) during asecond time interval; and C3 is sensed by the body surface sensor 100using the sensing signal at the sensing frequency (e.g., f_sense (i))during a third time interval.

Each of the sensed signals is transmitted by the e-field signaltransmitter 90 using the same e-field transmit frequency in a TDMAmanner. For example, the sensed data of the first capacitor istransmitted using tx/rx frequency of f_tx/rx (i)) during the first timeinterval; the sensed data of the second capacitor is transmitted usingthe tx/rx frequency during the second time interval; and the sensed dataof the third capacitor is transmitted using the same tx/rx frequencyduring the third time interval.

FIGS. 54A - 54D are a top, a front, a bottom, and a side view diagramsof an example of a foot force sensing cell unit 225 that includes aprinted circuit board (PCB) 280, an electrode/antenna 252, threecapacitors 284, three capacitor contact pads 282, and a foot forcesensor die 260 and/or 270. The PCB functions as an insulator between theelectrode/antenna 252 and the capacitor contact pads 282.

The electrode/antenna 252 includes a monopole or dipole pattern (e.g.,spiral or other meandering shape) that functions as an antenna for RFcommunications and as an electrode for e-field signals. For efficientelectromagnetic radiation of RF signals, the length of the pattern forthe antenna is ½ +/- 10% of the wavelength of the RF signals, where thewavelength (λ) = the speed of light (c) divided by the frequency (f) ofthe signals (e.g., λ = c/f).

For example, an RF signal that has a frequency of 2 GHz has a wavelengthof (3*10^8 m/s) / (2*10^9 cycles/second) = 0.15 meters. Thus, ½wavelength is 7.5 centimeters (cm), which would be the length of thepattern for the antenna portion of the electrode/antenna 252.

For an e-field signal that has a frequency of 1 MHz, the wavelength is(3*10^8 m/s) / (1*10^6 cycles/second), which equals 300 meters. With alength of 7.5 cm, the electrode/antenna 252 is inefficient atelectromagnetic radiation of the 1 MHz e-field signal but is efficientat electric field radiation of the e-field signal through the body toanother electrode.

The electrode/antenna 252 is printed on the top side of the foot forcesensing cell unit 225, where the top is toward the foot in a sole piece(e.g., an insole, a midsole, and/or an outsole). The capacitor contactpads 282 are printed on the bottom of the foot force sensing cell unit225 and coupled to the IC 260/270 via printed traces. The IC 260/270 isalso mounted on the bottom and soldered into place. An adhesive may alsobe used to further secure the IC in place.

There are a variety of ways to implement the foot force sensing cellunit 225. For example, the foot force sensing cell unit 225 is installedin a housing (not shown). As another example, the foot force sensingcell unit 225 is encapsulated with a material that has a much lowerdurometer rating than the capacitors 284 such that the capacitors aresubstantially free to move as a result of compression. As yet anotherexample, the foot force sensing cell unit 225 includes more or less thanthree capacitors 284. In a further example, the foot force sensing cellunit 225 has a circular shape from the top view, where the diameter ofthe cell unit 225 is 0.25 inches to 2 inches, or more. In a stillfurther example, the foot force sensing cell unit 225 has another shape(e.g., square, rectangle, oval, pentagon, hexagon, etc.) from the topview.

In an embodiment, the foot force sensing cell unit 225 is a wireless andbatteryless device that is powered by recovering energy from RF signalsand communicates sensed foot force data via e-field signal through abody. In another embodiment, the foot force sensing cell unit 225 iswireless and assisted passive device. By being wireless and passivedevice, the cell units 225 provide unparalleled durability, ease of use,and/or longevity for in-shoe foot force sensing circuits.

FIG. 55 is a schematic block diagram of an example of a sole piece 290(e.g., insole, midsole, and/or outsole) that includes receptacles 292for foot force sensing cell units 225. The number and positioning of thereceptacles 292 varies depending on foot force sensing objectives and/oron the size of the foot force sensing cell units 225. For example, thesole piece 290 includes three receptacles: one in the heel section, onein the forefoot medial area, and the third in the forefoot lateral area.As another example, sole piece 290 includes fifteen receptacles 292 asshown. As a further example, the sole piece 290 includes twenty or morereceptacles 292 for full coverage of the sole piece 290.

FIGS. 56A - 56E are schematic block diagrams of an example of placing afoot force sensing cell unit 225 in a receptacle of a sole piece 290 ofFIG. 55 . FIG. 56A is an isometric view of a foot force sensing cellunit 225. FIG. 56B is a side view of a foot force sensing cell unit 225.FIG. 56C is a cross-section side view of a respectable 292 of the solepiece 290.

From the side view, the sole piece includes an opening 293, an uppersection 295, a semi-rigid piece 296, a lower section 297. The uppersection 295 is comprised of a gel, foam, rubber, TPU (thermoplasticpolyurethane), EVA (ethylene-vinyl acetate), cork, plastic, and/orpadding that has a lower durometer than the capacitors of the unit 225.The lower section 297 is of the same material as the upper section or adifferent material. If the upper and lower sections are of the samematerial, the sole piece includes the semi-rigid plate 296, which iscomprised of plastic, rubber, a TPU, EVA, etc. that has a higherdurometer than the lower and upper sections. If the lower section is ofa different material (e.g., gel, foam, rubber, TPU, EVA, and/or paddingand has a higher durometer than the upper section), the semi-rigid plate296 is omitted.

The opening is sized to receive the foot force sensing cell unit 225. Inthe present example, the capacitors are not encapsulated or housed in ahousing. As such, the opening 293 is shaped to receive the threecapacitors and the printed circuit board such that the top of theprinted circuit board substantially aligns with the top edge of theupper section 295.

FIG. 56D illustrates the foot force sensing cell unit 225 installed inthe opening 293 of a receptacle 292. The unit 225 is secured in placevia a top layer 298, which has electrical characteristics that allow thee-field signals to pass between the electrode/antenna and a foot withnegligible interference and does not adversely affect the reception ofRF signals by the electrode/antenna.

FIG. 56E illustrates the foot force sensing cell unit 225 installed inthe opening 293 of a receptacle 292 without a top layer 296. In thisexample embodiment, the unit 225 is secured in the opening 293 via anadhesive, via a pressure fit, via a twist lock, via a tap & diecoupling, and/or other securing mechanism.

FIG. 57 is a schematic block diagram of another example of a sole piece290 that includes receptacles 292 for foot force sensing cell units 225.In this example, the sole piece 290 includes four receptacles 292, butcould include more or less receptacles 292.

FIGS. 58A - 58E are schematic block diagrams of an example of placing afoot force sensing cell 225 in a receptacle 292 of a sole piece 290 ofFIG. 57 . FIG. 58A is an isometric view of a foot force sensing cellunit 225. FIG. 58B is a side view of a foot force sensing cell unit 225.

FIG. 58C is a cross-section side view of a respectable 292 of the solepiece 290. From the side view, the sole piece includes an opening 293,an upper section 295, and a semi-rigid piece 296. The upper section 295is comprised of a gel, foam, rubber, TPU (thermoplastic polyurethane),EVA (ethylene-vinyl acetate), cork, plastic, and/or padding that has alower durometer than the capacitors of the unit 225.

FIG. 58D illustrates the foot force sensing cell unit 225 installed inthe opening 293 of a receptacle 292. The unit 225 is secured in placevia a top layer 298. FIG. 58E illustrates the foot force sensing cellunit 225 installed in the opening 293 of a receptacle 292 without a toplayer 296. In this example embodiment, the unit 225 is secured in theopening 293 via an adhesive, via a pressure fit, via a twist lock, via atap & die coupling, and/or other securing mechanism.

FIG. 59 is a schematic block diagram of another example of a bodyposition/motion marker 22 that includes an electrode 32, an e-fieldsignal receiver 70, an e-field signal transmitter 90, an ADC, a powersource module 150, an antenna 152, a processing module 222, memory 224,an ADC, an RSSI (received signal strength indication) module 300, and asecond antenna 304. The electrode 32, the e-field signal receiver 70,the e-field signal transmitter 90, the ADC, the power source module 150,the antenna 152, the processing module 222, the memory 224, and the ADCfunction as previously discussed regarding inbound e-field signals,inbound signals, input data 226, transmitting parameters 94, andreceiving parameters 80.

In this embodiment, the personal coordinate unit 20 transmits an RFsignal to the marker 22 (e.g., a 28 GHz and/or 60 GHz signal). Theantenna 304, which is sized for 28 GHz and/or 60 GHz signals, receivesthe RF signal. The RSSI module 300 determines the RSSI 302 of the RFsignal and provides it as outbound data to the e-field signaltransmitter 90. The e-field signal transmitter 90 converts the RSSI 302(e.g., one or more RSSI measurements) into an outbound e-field signalthat is conveyed through the electrode 32 and the body 30 to thecommunication device 12.

FIG. 60 is a schematic block diagram of another example of an integratedbiometric sensor and body position/motion marker 28 that includeselectrodes 32, an e-field signal receiver 70, an e-field signaltransmitter 90, a body surface sensor 100, a power source module 150, anantenna 152, an ADC, a processing module 222, memory 224, an RSSI module300, and a second antenna 304. The processing module 222 coordinatese-field signal transmissions of the body sensed data and the RSSI data302. In an embodiment, the body sensed data and the RSSI data areassigned individual tx/rx e-field frequencies such that they can betransmitted concurrently. In another embodiment, e-field signaltransmission of the body sensed data and the RSSI data uses the sametx/rx e-field frequency in a time sharing manner.

It is noted that terminologies as may be used herein such as bit stream,stream, signal sequence, etc. (or their equivalents) have been usedinterchangeably to describe digital information whose contentcorresponds to any of a number of desired types (e.g., data, video,speech, text, graphics, audio, etc. any of which may generally bereferred to as ‘data’).

As may be used herein, the terms “substantially” and “approximately”provide an industry-accepted tolerance for its corresponding term and/orrelativity between items. For some industries, an industry-acceptedtolerance is less than one percent and, for other industries, theindustry-accepted tolerance is 10 percent or more. Other examples ofindustry-accepted tolerance range from less than one percent to fiftypercent. Industry-accepted tolerances correspond to, but are not limitedto, component values, integrated circuit process variations, temperaturevariations, rise and fall times, thermal noise, dimensions, signalingerrors, dropped packets, temperatures, pressures, material compositions,and/or performance metrics. Within an industry, tolerance variances ofaccepted tolerances may be more or less than a percentage level (e.g.,dimension tolerance of less than +/- 1%). Some relativity between itemsmay range from a difference of less than a percentage level to a fewpercent. Other relativity between items may range from a difference of afew percent to magnitude of differences.

As may also be used herein, the term(s) “configured to”, “operablycoupled to”, “coupled to”, and/or “coupling” includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for an example of indirectcoupling, the intervening item does not modify the information of asignal but may adjust its current level, voltage level, and/or powerlevel. As may further be used herein, inferred coupling (i.e., where oneelement is coupled to another element by inference) includes direct andindirect coupling between two items in the same manner as “coupled to”.

As may even further be used herein, the term “configured to”, “operableto”, “coupled to”, or “operably coupled to” indicates that an itemincludes one or more of power connections, input(s), output(s), etc., toperform, when activated, one or more its corresponding functions and mayfurther include inferred coupling to one or more other items. As maystill further be used herein, the term “associated with”, includesdirect and/or indirect coupling of separate items and/or one item beingembedded within another item.

As may be used herein, the term “compares favorably”, indicates that acomparison between two or more items, signals, etc., provides a desiredrelationship. For example, when the desired relationship is that signal1 has a greater magnitude than signal 2, a favorable comparison may beachieved when the magnitude of signal 1 is greater than that of signal 2or when the magnitude of signal 2 is less than that of signal 1. As maybe used herein, the term “compares unfavorably”, indicates that acomparison between two or more items, signals, etc., fails to providethe desired relationship.

As may be used herein, one or more claims may include, in a specificform of this generic form, the phrase “at least one of a, b, and c” orof this generic form “at least one of a, b, or c”, with more or lesselements than “a”, “b”, and “c”. In either phrasing, the phrases are tobe interpreted identically. In particular, “at least one of a, b, and c”is equivalent to “at least one of a, b, or c” and shall mean a, b,and/or c. As an example, it means: “a” only, “b” only, “c” only, “a” and“b”, “a” and “c”, “b” and “c”, and/or “a”, “b”, and “c”.

As may also be used herein, the terms “processing module”, “processingcircuit”, “processor”, “processing circuitry”, and/or “processing unit”may be a single processing device or a plurality of processing devices.Such a processing device may be a microprocessor, microcontroller,digital signal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on hard coding of thecircuitry and/or operational instructions. The processing module,module, processing circuit, processing circuitry, and/or processing unitmay be, or further include, memory and/or an integrated memory element,which may be a single memory device, a plurality of memory devices,and/or embedded circuitry of another processing module, module,processing circuit, processing circuitry, and/or processing unit. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, cache memory, and/or any device that stores digital information.Note that if the processing module, module, processing circuit,processing circuitry, and/or processing unit includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that if the processing module, module, processing circuit,processing circuitry and/or processing unit implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element may store, and the processing module, module,processing circuit, processing circuitry and/or processing unitexecutes, hard coded and/or operational instructions corresponding to atleast some of the steps and/or functions illustrated in one or more ofthe Figures. Such a memory device or memory element can be included inan article of manufacture.

One or more embodiments have been described above with the aid of methodsteps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claims. Further, the boundariesof these functional building blocks have been arbitrarily defined forconvenience of description. Alternate boundaries could be defined aslong as the certain significant functions are appropriately performed.Similarly, flow diagram blocks may also have been arbitrarily definedherein to illustrate certain significant functionality.

To the extent used, the flow diagram block boundaries and sequence couldhave been defined otherwise and still perform the certain significantfunctionality. Such alternate definitions of both functional buildingblocks and flow diagram blocks and sequences are thus within the scopeand spirit of the claims. One of average skill in the art will alsorecognize that the functional building blocks, and other illustrativeblocks, modules and components herein, can be implemented as illustratedor by discrete components, application specific integrated circuits,processors executing appropriate software and the like or anycombination thereof.

In addition, a flow diagram may include a “start” and/or “continue”indication. The “start” and “continue” indications reflect that thesteps presented can optionally be incorporated in or otherwise used inconjunction with one or more other routines. In addition, a flow diagrammay include an “end” and/or “continue” indication. The “end” and/or“continue” indications reflect that the steps presented can end asdescribed and shown or optionally be incorporated in or otherwise usedin conjunction with one or more other routines. In this context, “start”indicates the beginning of the first step presented and may be precededby other activities not specifically shown. Further, the “continue”indication reflects that the steps presented may be performed multipletimes and/or may be succeeded by other activities not specificallyshown. Further, while a flow diagram indicates a particular ordering ofsteps, other orderings are likewise possible provided that theprinciples of causality are maintained.

The one or more embodiments are used herein to illustrate one or moreaspects, one or more features, one or more concepts, and/or one or moreexamples. A physical embodiment of an apparatus, an article ofmanufacture, a machine, and/or of a process may include one or more ofthe aspects, features, concepts, examples, etc. described with referenceto one or more of the embodiments discussed herein. Further, from figureto figure, the embodiments may incorporate the same or similarly namedfunctions, steps, modules, etc. that may use the same or differentreference numbers and, as such, the functions, steps, modules, etc. maybe the same or similar functions, steps, modules, etc. or differentones.

While transistors may be shown in one or more of the above-describedfigure(s) as field effect transistors (FETs), as one of ordinary skillin the art will appreciate, the transistors may be implemented using anytype of transistor structure including, but not limited to, bipolar,metal oxide semiconductor field effect transistors (MOSFET), N-welltransistors, P-well transistors, enhancement mode, depletion mode, andzero voltage threshold (VT) transistors.

Unless specifically stated to the contra, signals to, from, and/orbetween elements in a figure of any of the figures presented herein maybe analog or digital, continuous time or discrete time, and single-endedor differential. For instance, if a signal path is shown as asingle-ended path, it also represents a differential signal path.Similarly, if a signal path is shown as a differential path, it alsorepresents a single-ended signal path. While one or more particulararchitectures are described herein, other architectures can likewise beimplemented that use one or more data buses not expressly shown, directconnectivity between elements, and/or indirect coupling between otherelements as recognized by one of average skill in the art.

The term “module” is used in the description of one or more of theembodiments. A module implements one or more functions via a device suchas a processor or other processing device or other hardware that mayinclude or operate in association with a memory that stores operationalinstructions. A module may operate independently and/or in conjunctionwith software and/or firmware. As also used herein, a module may containone or more sub-modules, each of which may be one or more modules.

As may further be used herein, a computer readable memory includes oneor more memory elements. A memory element may be a separate memorydevice, multiple memory devices, or a set of memory locations within amemory device. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, cache memory, and/or any device thatstores digital information. The memory device may be in a form asolid-state memory, a hard drive memory, cloud memory, thumb drive,server memory, computing device memory, and/or other physical medium forstoring digital information.

As applicable, one or more functions associated with the methods and/orprocesses described herein can be implemented via a processing modulethat operates via the non-human “artificial” intelligence (AI) of amachine. Examples of such AI include machines that operate via anomalydetection techniques, decision trees, association rules, expert systemsand other knowledge-based systems, computer vision models, artificialneural networks, convolutional neural networks, support vector machines(SVMs), Bayesian networks, genetic algorithms, feature learning, sparsedictionary learning, preference learning, deep learning and othermachine learning techniques that are trained using training data viaunsupervised, semi-supervised, supervised and/or reinforcement learning,and/or other AI. The human mind is not equipped to perform such AItechniques, not only due to the complexity of these techniques, but alsodue to the fact that artificial intelligence, by its very definition —requires “artificial” intelligence — i.e., machine/non-humanintelligence.

As applicable, one or more functions associated with the methods and/orprocesses described herein can be implemented as a large-scale systemthat is operable to receive, transmit and/or process data on alarge-scale. As used herein, a large-scale refers to a large number ofdata, such as one or more kilobytes, megabytes, gigabytes, terabytes ormore of data that are received, transmitted and/or processed. Suchreceiving, transmitting and/or processing of data cannot practically beperformed by the human mind on a large-scale within a reasonable periodof time, such as within a second, a millisecond, microsecond, areal-time basis or other high speed required by the machines thatgenerate the data, receive the data, convey the data, store the dataand/or use the data.

As applicable, one or more functions associated with the methods and/orprocesses described herein can require data to be manipulated indifferent ways within overlapping time spans. The human mind is notequipped to perform such different data manipulations independently,contemporaneously, in parallel, and/or on a coordinated basis within areasonable period of time, such as within a second, a millisecond,microsecond, a real-time basis or other high speed required by themachines that generate the data, receive the data, convey the data,store the data and/or use the data.

As applicable, one or more functions associated with the methods and/orprocesses described herein can be implemented in a system that isoperable to electronically receive digital data via a wired or wirelesscommunication network and/or to electronically transmit digital data viaa wired or wireless communication network. Such receiving andtransmitting cannot practically be performed by the human mind becausethe human mind is not equipped to electronically transmit or receivedigital data, let alone to transmit and receive digital data via a wiredor wireless communication network.

As applicable, one or more functions associated with the methods and/orprocesses described herein can be implemented in a system that isoperable to electronically store digital data in a memory device. Suchstorage cannot practically be performed by the human mind because thehuman mind is not equipped to electronically store digital data.

While particular combinations of various functions and features of theone or more embodiments have been expressly described herein, othercombinations of these features and functions are likewise possible. Thepresent disclosure is not limited by the particular examples disclosedherein and expressly incorporates these other combinations.

What is claimed is:
 1. A biometric sensor comprises: a body surface sensor operably coupled to: create a drive-sense signal at a first frequency based on one or more sensing parameters; provide, when operably coupled to a body via one or more electrodes, the drive-sense signal to the body; detect effect on the drive-sense signal based on electrical characteristics of the body; and generate a data signal based on the detected effect, wherein the data signal is a representation of the electrical characteristics of the body; and an e-field signal transmitter operable to: generate an outbound signal reference at a second frequency based on the data signal and one or more transmit parameters; and drive the outbound reference signal to the body, wherein the outbound reference signal is transmitted within at least a portion of the body as an outbound e-field signal at the second frequency.
 2. The biometric sensor of claim 1 further comprises: a power source module operable to generate a voltage from at least one of a battery voltage, a radio frequency (RF) signal, light, heat, motion, and pressure, wherein the power source provides the voltage to the body surface sensor and the e-field signal transmitter.
 3. The biometric sensor of claim 1 further comprises: an e-field signal receiver operable to: receive an inbound e-field signal at a third frequency; generate an inbound signal based on the inbound e-field signal and one or more receiving parameters, wherein the inbound signal includes one or more of: the one or more sensing parameters, the one or more transmit parameters, and the one or more receive parameters.
 4. The biometric sensor of claim 1 further comprises: a processing module operably coupled to perform one or more of: generate the one or more sensing parameters based on input data; generate the one or more transmit parameters based on the input data; and generate one or more receive parameters based on the input data.
 5. The biometric sensor of claim 1, wherein a sensing parameter of the one or more sensing parameters comprises one of: one or more filter settings, wherein a filter setting of the one or more filter settings includes one of: a center frequency, a low frequency cut-off, a high frequency cut-off, a center frequency gain, selectivity, a filter order regarding a rate of attenuation outside of a band pass region; and one or more sense signal settings, wherein a sense signal setting of the one or more sense signal settings includes one of: a frequency of a sense signal, a signal form of the sense signal, a magnitude of the sense signal, and a phase shift of the sense signal, wherein the drive-sense corresponds to the sense signal.
 6. The biometric sensor of claim 1, wherein the data signal comprises one of: an analog data signal; and a digital data signal.
 7. The biometric sensor of claim 1 further comprises: a first electrode of the one or more electrodes coupled to a first surface area of the body; and a second electrode of the one or more electrodes coupled to a second surface area of the body, wherein the electrical characteristics of the body is regarding an area on and/or near surface of the body encompassing the first and second surface areas.
 8. The biometric sensor of claim 1 further comprises: an electrical characteristic of the electrical characteristics of the body includes one of: an AC voltage source that is representative of one or more electrochemical reactions of the body; an impedance network of the body or a portion of the body; and a conducting current as function of the AC voltage source and the impedance network; and the data signal corresponds to a physiological response of the body in accordance with the electrical characteristics of the body.
 9. The biometric sensor of claim 1, wherein the detecting the effect on the drive-sense signal comprises: regulating a voltage of the drive-sense signal by varying the current of the drive-sense signal as impedance of the body changes, wherein the impedance is one of the electrical characteristics of the body, wherein the varying of the current corresponds to the effect on the drive-sense signal.
 10. The biometric sensor of claim 1 further comprises: an integrated circuit (IC) on which the body surface sensor and the e-field signal transmitter are fabricated; and a flexible printed circuit board on which the IC is mounted, wherein the flexible printed circuit board has an adhesive backing for adhering to a portion of the body.
 11. A biometric sensor comprises: a sense element; a body surface sensor operably coupled to: create a drive-sense signal at a first frequency based on one or more sensing parameters; provide, when the biometric sensor is operably coupled to a body, the drive-sense signal to the body to the sense element; detect effect on the drive-sense signal based on electrical characteristics of the sense element; and generate a data signal based on the detected effect, wherein the data signal is a representation of the body affecting the sense element; and an e-field signal transmitter operable to: generate an outbound signal reference at a second frequency based on the data signal and one or more transmit parameters; and drive the outbound reference signal to the body, wherein the outbound reference signal is transmitted within at least a portion of the body as an outbound e-field signal at the second frequency.
 12. The biometric sensor of claim 11 further comprises: a power source module operable to generate a voltage from at least one of a battery voltage, a radio frequency (RF) signal, light, heat, motion, and pressure, wherein the power source provides the voltage to the body surface sensor and the e-field signal transmitter.
 13. The biometric sensor of claim 11 further comprises: an e-field signal receiver operable to: receive an inbound e-field signal at a third frequency; generate an inbound signal based on the inbound e-field signal and one or more receiving parameters, wherein the inbound signal includes one or more of: the one or more sensing parameters, the one or more transmit parameters, and the one or more receive parameters.
 14. The biometric sensor of claim 11 further comprises: a processing module operably coupled to perform one or more of: generate the one or more sensing parameters based on input data; generate the one or more transmit parameters based on the input data; and generate one or more receive parameters based on the input data.
 15. The biometric sensor of claim 11, wherein a sensing parameter of the one or more sensing parameters comprises one of: one or more filter settings, wherein a filter setting of the one or more filter settings includes one of: a center frequency, a low frequency cut-off, a high frequency cut-off, a center frequency gain, selectivity, a filter order regarding a rate of attenuation outside of a band pass region; and one or more sense signal settings, wherein a sense signal setting of the one or more sense signal settings includes one of: a frequency of a sense signal, a signal form of the sense signal, a magnitude of the sense signal, and a phase shift of the sense signal, wherein the drive-sense corresponds to the sense signal.
 16. The biometric sensor of claim 11, wherein the data signal comprises one of: an analog data signal; and a digital data signal.
 17. The biometric sensor of claim 11, wherein the sense element comprises one or more of: a thermocouple; a pad whose impedance varies based on the level of moisture it absorbs; a transducer whose electrical characteristics vary with vibration of the transducer; and a variable impendence whose impedance changes with expansion and/or contraction.
 18. The biometric sensor of claim 11 further comprises one or more of: the data signal corresponds to a physiological response of the body; and the data signal corresponds to a biomechanical expression of the body.
 19. The biometric sensor of claim 11, wherein the detecting the effect on the drive-sense signal comprises: regulating a voltage of the drive-sense signal by varying the current of the drive-sense signal as impedance of the sense element changes, wherein the impedance is one of the electrical characteristics of the sense element, wherein the varying of the current corresponds to the effect on the drive-sense signal.
 20. The biometric sensor of claim 11 further comprises: an integrated circuit (IC) on which the body surface sensor and the e-field signal transmitter are fabricated; and a flexible printed circuit board on which the IC and the sense element are mounted, wherein the flexible printed circuit board has an adhesive backing for adhering to a portion of the body. 